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Shanghai Sharetek Technology Co.,ltd.

Shanghai,  Shanghai 
China
http://en.sharetek.com.cn/
  • Booth: 3609

Overview

One of the best supplies of  a combination of hardware and software intelligent manufacturing solutions

Founded in 2007 with its headquarter in Shanghai, Sharetek is a high-tech enterprise committed to "combining hardware and software to create an Internet of Everything world. The company mainly focuses on self-developed intelligent equipment, automation and self-developed industrial software, dedicated to provide customers with a combination of hardware and software intelligent manufacturing solutions.

Sharetek has built smart factory and automated production line  for key player in semiconductor assembly and test area, especially focus in IGBT module manufacturing area .

Sharetek has R&D bases in Shanghai, Hangzhou, Xi'an and Chengdu, where production site are bases in Shanghai, Hangzhou and Jiaxing Pinghu (more than 15,000 square meters of transitional plants and more than 40 acres of plants under construction). 70% of employees are engineering and R&D personnel. Meanwhile, the company has technical support and sales teams in Zhuzhou, Beijing, Taiwan and Malaysia, and is committed to providing efficient services to our customers.


  Products

  • Die attached bonder
    This equipment is used for precision mounting of wafer chips, bulk chips, solder, resistors and capacitors, and other materials.
    ...

  • Equipment Features

    High mounting accuracy: mounting position accuracy up to ±10μm@3s; mounting pressure accuracy of ±3g
    Fast mounting speed: UPH up to 2000pcs
    Flexible compatibility with chips, capacitors, resistors and other materials
    Small footprint and low cost
    Meet the protocols of SECS/GEM, SMEMA, etc. and support MES interfacing
    Modular design allows customers to configure the modules they need according to their process requirements

    Applicable Materials

    Materials such as Si, GaAs and other wafer/bulk dies, resistors/capacitors, etc.

    Dispensing & Dipping Systems

    • Precise control of dispensing pressure and time
    • Syringes can be selected according to demand
    • Can be dispensed with glue or solder paste

    Visual Correction System

    • High-speed image processing unit
    • Configurable algorithms for different scenarios
    • Easy operation

    Quick-change system for suction tips

    • Automatic quick-change tips
    • Optional 4 or 14 tips
    • Configuration calibration tips

    Product Pick & Place System

    • Suitable for a wide range of dies and other components
    • Suitable for a wide range of feed types
    • Compatible with different carriers

    Technical Specifications

    UPH

    up to 2000pcs

    Bonding accuracy

    ±10μm@3s;±0.8°@3s

    Bond force

    15g‒1kg(Can be programmed)

    Bond force accurary

    ±3g

    Bond heads

    8、16(Optional)

    Die size

    0.2mmX0.2mm~30X30mm

    Die thickness

    0.05mm~7mm

    Wafer

    6", 8", 12"

    Substrate and cassette types

    Waffle pack/Gel-Pak® (2" or 4"), JEDEC tray, ceramic, BGA, flex board, carrier boat, leadframe, laminated tray

    Feeder width 

    8mm‒44mm (Capacitor/Resistor loading )

    Substrate size 

    2mmX2mm-160mmX250mm

    Power Supply

    220V/50Hz

    Dimension (L×W×H)

    1280mmx1250mmx1900mm

    Weight

    1200kg

  • Fully Automated Pre-sintering Equipment
    Mounting accuracy: ±10μm@3s;±0.8°@3s
    Bond force: 45g~30kg
    UPH up to 700pcs ( (single die take+photo+put+heat))
    Compatible with pressure silver paste and pressure paste film process...

  • Equipment Features

    Mounting accuracy: ±10μm@3s;±0.8°@3s
    Bond force: 45g~30kg
    UPH up to 700pcs ( (single die take+photo+put+heat))
    Compatible with pressure silver paste and pressure paste film process
    Flexible compatibility with 6″, 8″, 12″wafer mounting; Small footprint 
    Substrate heating: room temperature~300°
    Meet the protocols of SECS/GEM and support MES interfacing
    Modular design allows customers to configure the modules they need according to their process requirements

    Applicable Materials

    SiC, GaAs and other wafers/bulk dies, AMB and other materials

    Heating System

    • Rapid temperature rise and fall 
    • Nitrogen Environmental Protection

    Visual Correction System

    • High-speed image processing unit
    • Configurable algorithms for different scenarios
    • Easy operation

    Quick-change system for suction tips

    • Automatic quick-change tips
    • Optional 4 or 14 tips
    • Configuration calibration tips

    Product Pick & Place System

    • Suitable for a wide range of dies and other components
    • Suitable for a wide range of feed types
    • Compatible with different carriers

    Technical Specifications

    Die size

    1X1mm~20X20mm

    Die thickness

    0.05mm~2mm

    UPH

    up to 700pcs (single chip take+photo+put+heat)

    Bonding accuracy

    ±10μm@3s;

    Bond force

    45g~30kg

    Bond heads 

    14 (standard and heated mounting head compatible)

    Heating Temperature of mounting Head

    300°C, heating accuracy ±5°C

    Heating module heating temperature

    300°C, heating accuracy ±5°C

    Insulation Heating Module

    Normal temperature -200℃

    Wafer

    6″, 8″, 12″

    Substrate and cassette types

    AMB boards, Waffle pack/Gel-Pak® (4-inch), etc.

    Dimension (L×W×H)

    1380mmx1300mmx1900mm

  • 3D Bonding Quality and Die Defect Detection
    The equipment is suitable for visual AOI inspection of IGBT modules after bonding.
    ...

  • Equipment Introduction

    Suitable for primary and secondary tying
    Applicable incoming production mode: on-line/magazine/tray type.
    Optical inspection is in high precision 2D+3D mode.
    With MES communication function.
    The equipment uses dust-free materials to meet the requirements for use in clean workshops.
    The equipment is equipped with plasma cleaning mechanism.
    Identify the product/carrier with a QR code and bind the test results.

    Equipment detection capability

    Technical Specifications

    Model

    XT EAGLE WBI 100 

      UPH

     1000pcs(single DBC) 

      Camera Configuration

      3D 4-eye mechanism light + 2D camera

      Camera Pixels

      2D:5um/pixel/3D10um/pixel

      Detection accuracy

      ±20μm

      Password Hierarchy Management

      Admin, Technician & Operator

      Product loading and unloading method

      On-line / Magazine / Tray type

      Compatible Product Widths

      150-300mm

      False alarm rate

      ≤1%

      Underreporting rate

      0

      Methods of double-checking

      On-line/off-line (with optional double-checking display)

      Dust/rust resistant design

      Class 10k

      Voltage level

      AC/220V 50/60HZ

      Communication function

      Reserved interfaces for MES systems, 

      SEMI communication standards SECS/GEM

    Dimension (L×W×H)

      1200mm x 1200mm x 1850mm(customization )

    Weight

      1500KG

    Power 

      1.2KW

  • Semiconductor Intelligent Factory Solutions
    The New Intelligent Factory Stack

    5 Core Technologies (4T + 1E)
    IE (Industrial Engineering) + IT (Informatization) + DT (Digitalization) + AT (Automation) + IoT (Internet of Things)
    ...

  • Solution introduction

    Sharetek Technology, through years of technological accumulation, has intelligentized a broad range of self-developed equipment and integrated the logistics system through self-controllable industrial software, committed to providing clients with the overall intelligent manufacturing solutions with the combination of software and hardware, so as to make the factory more powerful.
    The New Intelligent Factory Stack
    The Implementation of Full-stack Solutions
    The plant-wide project and implementation is available, including equipment automation,production line digitization, unit connectivity, intelligent warehousing and logistics, etc.
    Self-developed Intelligent Equipment Matrix
    The intelligent equipment, researched and developed independently and controllably, is capable of achieving domestic substitution in process, inspection and assembly.
    Intelligent Warehousing and Logistics System Solution
    Combined with the technology of Industrial Internet of Things (IIoT), an intelligent, automated logistics system driven by plant-wide information, can ultimately be finished through a real-time, comprehensive, and precise data platform based on logistics
    Independent and Controllable CIM System Solutions
    A semiconductor digital factory solution, integrating years of expert experience in the semi conductor field and adopting the latest generation of information system technology and platform, is able to meet the needs of both fully automated and semi-automated scenarios.
    Overall Hardware and Software System Integration
    Based on CPS and Industrial Internet of Things (IIot), it realizes the connectivity in manufacturing system, including the plant-wide products, equipment, manufacturing units, production lines, workshops, factories etc., and accomplishes the integration and unification within different process.
    The New Generation of Information Technology
    Transparent factories with big data applications, artificial intelligence algorithms, digitaltwins, etc., is competent at supporting the enterprise decision-making comprehensively and timely
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