Shenzhen HANCHI Technology Co.,Ltd. (MITEC, 2F, Hall 6, Booth 3128) with the latest and mature AUTO PACKING solution for SEMI, presents on SEMICON SEA 2024.
Thanks for the recognition from our key customers of Micron, Carsem etc. And many customers such as TI, Infineon, NXP, Intel, come for the AUTO PACKING solution inquiry. HANCHI will as usual create value for all customers, via our best solution, products and service. To promote the fully intelligent manufacturing of SEMI Assembly & Testing Finishing Processes, especially in the field of Reel/Tray auto packing process.