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ITEC B.V.

Nijmegen,  Netherlands
https://www.itecequipment.com/
  • Booth: 3125

ITEC - YOUR SEMICONDUCTOR EQUIPMENT AND AUTOMATION PARTNER.

Overview

High-accuracy, high-speed, high-quality semiconductor finishing processes—that’s ITEC. We combine state-of-the-art equipment and automation expertise with 30-plus years of in-company semiconductor manufacturing experience. In the presence of this strong foundation, combined with an entrepreneurial spirit and an innovative team, we are now getting ready for growth in new markets.


From fast, accurate die bonders and sorters for mass-produced semiconductor devices, to high-throughput production testers and highly efficient Automated Optical Inspection (AOI) systems. Plus, our smart manufacturing solution, ITECore, to help maximize your productivity. ITEC gives you a competitive technological edge in semiconductor manufacturing.


We’d love to listen to your challenges and see how we can partner up to supply the breakthrough technology you need.


  Press Releases

  • ITEC will make its mark at SEMICON SEA in Kuala Lumpur. With a focus on the semiconductor industry, this event will provide an excellent opportunity for ITEC to launch its newest ADAT3 XF Flip-Chip Die Bonder and engage with a diverse audience, garner feedback, and explore potential collaborations. See the live equipment demonstration and more! Meet us at our booth #3125.


  Products

  • ADAT3 XF DBFC - FLIP CHIP DIE BONDER
    The game changer in flip chip die bonding...

  • This revolutionary flip chip die bonder redefines precision and pace for a wide range of applications. Elevate your manufacturing game with the fastest, most efficient die bonding technology: every milli-second counts. In combination with a flux screenprint solution, ADAT3 XF Flip Chip Die Bonder runs 5 times faster than anything on the market, ensuring the lowest TCOO and operational excellence.

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