Fountyl Technologies PTE Ltd

Electrostatic chuck has the function of normal use in vacuum atmosphere, and plays the role of holding and temperature control of wafer in high vacuum plasma or special gas environment, assisting semiconductor process equipment to realize the change of electrical characteristics and physical form of specific areas of wafer, so that it presents specific functions. And through a series of other complex and demanding processes to eventually turn the wafer into a complex integrated circuit structure. Electrostatic chuck and electrostatic chuck heater are widely used in semiconductor core process, and are one of the core components of ion implantation, etching, vapor deposition of key processes.

With the process equipment and process technology development of semiconductor and integrated circuit, the traditional electrostatic chucks using organic polymer materials, metal oxides and ceramic materials as dielectrics are not fully compatible with such materials as silicon wafers, sapphire and silicon carbide. Therefore, electrostatic chucks compatible with the first, second and third generation semiconductor wafer grippers will gradually develop.

Polymer Electrostatic Chuck / Heater

Polymer Electrostatic Chuck With Heater

Ceramics Electrostatic Chuck / Heater

Al₂O₃ Electrostatic Chuck

AlN Electrostatic Chuck

Ceramics Electrostatic Chuck With Heater

Complex Type Electrostatic Chuck / Heater

Complex Type Electrostatic Chuck With Heater

Microporous ceramic vacuum chuck is also called nano microporous vacuum chuck, which means that a uniform solid or vacuum body is produced through a special nano powder manufacturing process, and a large number of connected or closed ceramic materials are generated inside the material through high temperature sintering. With its special structure, it has the advantages of high temperature resistance, wear resistance, chemical corrosion resistance, high mechanical strength, easy regeneration and excellent thermal shock resistance, which can be used for high temperature filtration materials, catalyst carriers, porous electrodes of fuel cells, sensitive components, separation membranes, bioceramics, etc., present the unique application advantages in chemical industry, environmental protection, energy, electronics, biochemistry.

Application:

Porous chuck (adsorption working table) is a component used in the semiconductor manufacturing stage and assembled on a scribing machine or inspection device. It is a product that can use the porous structure and negative pressure of the surface of the workbench to keep the thin silicon wafer flat. The scribing machine cuts the silicon wafer with the width about 20μm, so the requirement to flatness and parallelism of the wafer adsorption surface are very high.

According to their respective characteristics, different pore structures have different application ranges, such as microporous ceramics with large specific surface area and small pore size, usually used in bacterial filtration and microbial fixation fields; Mesoporous ceramics with their specific diameter distribution are often used in separation, adsorption catalysis fields. Macroporous ceramics are usually suitable for rough filtration of substances with a large content and large size.

Porous ceramic material characteristics:

Main ingredients: alumina                     Color: black, iron gray

Alumina content: 92%                           Moisture content: 0%

Aperture: 2~30um                                porosity: 35~40%

Bending strength :6kgf/cm2 (Mpa)      Volume ratio: 2.28g/cm3   

According to the usage, Ceramic chuck are divided into :

Thinning machine equipped with: abrasive disc chuck, silicon wafer, sapphire substrate and other thinning;

Cutting machine equipped with: scribing chuck, silicon wafer, semiconductor compound wafer and other cutting;

Cleaning machine equipped with: cleaning chuck;

Film removing machine equipped with: film removing chuck;

Laminating machine equipped with: laminating chuck;

Printing machine equipped with: printing chuck.

With the development of gas lubrication technology, the air floating platform with its low friction, high cleanliness, long life, high motion accuracy characteristics are widely used in the need to offset gravity occasions and tests, but the air floating platform in the use of large noise, low bearing shortcomings, in the requirements of quiet working environment and high bearing occasions limit its use.

The traditional air floating platform generally adopts small hole throttling, torus throttling or slit throttling technology, which is characterized by simple processing technology, but when the supply air pressure changes, it is easy to produce whistling phenomenon, the sound is sharp, and the bearing capacity also fluctuates, which is not suitable for quiet and stable pressure working environment.

The load transfer technology of non-contact air floating platform:

Non-contact conveying and load shifting equipment is mainly to improve the problems caused by traditional handling technology after the glass substrate becomes larger, because in the conveying and load shifting process is not directly in contact with the operation object, so it can avoid the occurrence of pollutant attachment, stress, static electricity and damage to the glass substrate. Porous material, on the other hand, significantly reduces gas flow, achieves uniform air pressure and good distribution of air cushion, and provides sufficient floating height required for operation.

Working principle:

The structure of the air floating platform is composed of nano-porous ceramics embedded in the base to form a vacuum chamber. clean compressed air with water-free and oil-free is input into the air mode gap between the bearing surface and the air floating guide rail through the gas pipe. The gas flows in the air mode gap to make the bearing surface float on the air floating guide rail. The gas acts as a lubricant to move or transport objects without friction.

The construction for common air floating hole:

a) Orifice throttling structure

b) Porous structure

The largest customized size: length 1600mm, width 1000mm

Ring groove chuck (Groove chuck) is a commonly used industrial chuck in the semiconductor industry, with high temperature resistance, corrosion resistance, wear resistance and other characteristics. Usually made of silicon carbide or alumina ceramic materials.
It is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Features:
High temperature resistance: Silicon carbide and alumina ceramic materials have excellent high temperature performance, can be used in high temperature environment for a long time, not easy to deformation or fracture.
Corrosion resistance: can withstand a variety of chemical corrosion, suitable for handling corrosive liquids or gases in the working environment.
Wear resistance: high hardness, with good wear resistance, can be used for a long time without failure.
Strong adsorption force: the groove structure reduces the contact area of the chuck, thereby increasing the adsorption force of unit area and enabling the workpiece to be adsorbed more firmly.
High stability: Due to the characteristics of the material, the chuck has high stability and can work stably for a long time.

Process control:
High precision: 12 inches diameter, flatness is controlled within 2 μm; If you need more precision, please email us.
Shape control: Adjust the chuck shape according to the wafer shape
Absorptive responsiveness: Customized design according to specifications

Applications:
Wafer fixation of semiconductor exposure device
Wafer fixation of wafer inspection device 

Our services:
The selection of ring groove chuck should be considered according to multiple factors such as the required diameter of the chuck, and the shape of the chuck, and make a suitable choice according to the size, weight of the adsorption object and the requirements of the working environment.
We use precision flat machining technology, implement creative design for custom, and provide the best chuck to meet the strict requirements of customers.
The flat shape of the chuck can be freely adjusted according to the shape of the wafer, the adsorption area can be customized to improve the adsorption responsiveness.
Material: Aluminum oxide ceramic or silicon carbide can be selected, and DLC and Teflon can be plated on the surface.

Ceramic end effector (ceramic finger, ceramic mechanical arm)

Ceramics have the characteristics of high temperature resistance, corrosion resistance, wear resistance, insulation, etc., and can work for a long time in a variety of semiconductor production equipment under high temperature, vacuum or corrosive gas conditions.
Ceramic materials can be selected alumina ceramics, silicon carbide ceramics, zirconia ceramics, etc., through cold isostatic pressing, high temperature sintering and precision machining, unique ceramic bonding technology, can be customized according to your drawings or samples.
Ceramic end effector is used by robot when removing and placing silicon wafers from a box or processing chamber.
The reason for using ceramic materials is to reduce warping problems due to high strength handling, as well as the ceramic materials can withstand high temperature environments and solve problems such as metal pollution and dust generation.
OEM high precision ceramic parts such as ceramic end effector. 

Can process a variety of ceramic materials, such as Al2O3, ZrO2, Si3N4, SiC, quartz; We can also do some coating metallized, ceramic, teflon, we can accept OEM drawings and samples of ceramic parts in any size.

Application field:
Semiconductor industry, transfer wafers or silicon wafers;

Materials：alumina ceramic, silicon carbide.

Wafer pin chuck is industrial chuck commonly used in the semiconductor industry , with high temperature resistance, corrosion resistance, wear resistance and other characteristics. It is usually made of silicon carbide or alumina ceramic material with a raised point-like structure on the surface to provide better adsorption and stability.
Convex chuck are widely used in semiconductor production equipment to absorb, fix, transfer and handle silicon wafers, wafers and various workpieces and materials.

Features:
High temperature resistance: Silicon carbide and alumina ceramic materials have excellent high temperature performance, can be used in high temperature environment for a long time, not easy to deformation or fracture.
Corrosion resistance: can withstand a variety of chemical corrosion, suitable for handling corrosive liquids or gases in the working environment.
Wear resistance: high hardness, with good wear resistance, can be used for a long time without failure.
Strong adsorption: the convex point structure reduces the contact area of the suction cup, thereby increasing the adsorption force per unit area, and can more firmly adsorb the workpiece.
High stability: Due to the characteristics of the material, the wafer pin chuck has high stability and can work stably for a long time.
Reduce pollution: Ceramic wafer chucks are evolving from grooves to pins to reduce contact area, reduce some pollution and improve warping correction.

Process control:
High precision: 12 inches diameter, flatness is controlled within 5 μm; If you need more precision, please email us.
Shape control: Adjust the chuck shape according to the wafer shape (non-uniformity control)
Absorptive responsiveness: Customized design according to specifications

Applications:
Wafer fixation of semiconductor exposure device
Wafer fixation of wafer inspection device

Our services:
The selection of wafer pin chuck should be considered according to multiple factors such as the required diameter of the suction cups, the number of convex points, and the shape of the chuck, and make a suitable choice according to the size, weight of the adsorption object and the requirements of the working environment.
We adopted precision flat machining technology, implement creative design for custom, and provide the best wafer pin chuck to meet the strict requirements of customers.
The flat shape of the pin chuck can be freely adjusted according to the shape of the wafer, and the adsorption area or pin pattern can be customized to improve the adsorption responsiveness.
Material: Aluminum oxide ceramic or silicon carbide can be selected, and DLC and Teflon can be plated on the surface.
High-precision SiC/SSiC wafer pin chucks are being developed for wafer exposure, inspection, transportation processes that are highly flexible, very flat, and extremely resistant to harsh working environments.