Micron Memory Malaysia Sdn. Bhd.

Batu Kawan,  Penang 
Malaysia
https://www.micron.com

• Booth: 3203

Welcome to Micron Malaysia. Your future starts here!

Overview

  Press Releases

• Micron First to Production of 200+ Layer QLC NAND in Client and Data Center (Apr 17, 2024)

  Micron’s 2500 SSD outperforms rivals with cutting-edge QLC NAND

  BOISE, Idaho, April 16, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today demonstrated its continued NAND technology leadership by announcing that its 232-layer QLC NAND is now in mass production and shipping in select Crucial® SSDs, in volume production to enterprise storage customers and sampling to OEM PC manufacturers in the Micron 2500 NMVeTM SSD.

  Micron 232-layer QLC NAND delivers unparalleled performance for use cases across mobile, client, edge and data center storage by leveraging these important capabilities:

  • Industry-leading bit-density, up to 28% more compact than leading competitors'1 latest products
  • Industry-leading NAND I/O speeds of 2400 MT/s,1 a 50% improvement over the prior generation2
  • 24% better read performance over the prior generation2
  • 31% better programming performance over the prior generation2

  “Micron’s 232-layer QLC NAND is a key enabler of our high-capacity DirectFlash® Module,” said Bill Cerreta, general manager of Hyperscale at Pure Storage®. “Thanks to Micron's NAND innovation, Pure Storage can take one more step on its quest to replace all HDDs in the data center by 2028.”

  ________________________
  1 Leading competitors are defined as SK Hynix, Solidigm, Kioxia, WD and Samsung.
  2 Comparisons are based on Micron 232-layer QLC NAND vs. previous Micron 176-layer QLC NAND generation. 

  
  Micron 2500 Client SSD
  The Micron 2500 raises the bar for everyday computing with its best-in-class performance to significantly enhance the PC user experience. For the second generation in a row, Micron is first to ship QLC-based client NVMe SSDs with the highest NAND layer count. The Micron 2500 SSD stands alone as the world's first client SSD to integrate 200+ layer QLC NAND.

  “We are impressed with the capabilities of the Micron 2500 SSD, so we are excited to qualify it for our mainstream platform storage options. With its leadership user experience, it is the perfect match for our high-performance AMD Ryzen™ processors,” said Joe Macri, senior vice president and corporate fellow at AMD.

  The 2500 SSD enables a user experience that surpasses competitive TLC- and QLC-based SSDs while also setting a new storage standard for productivity in daily PC applications and computing tasks. It has demonstrated superior PCMark® 10 experience benchmark results, outperforming the average scores of QLC and TLC competitors in the value SSD segment by up to 45%.3

  "Micron continues its leadership and innovation in the client SSD market as the industry shifts to QLC-based storage," said Prasad Alluri, vice president and general manager of Micron's Client Storage Group. "We anticipate that the 2500 SSD will further accelerate QLC adoption in PCs as it delivers a world-class user experience and value proposition."

  “By integrating the Micron 2500 QLC SSD into our PCs, we’re ensuring a superior user experience. Micron’s innovations in QLC NAND mean our customers enjoy the benefits of reliable storage without compromise,” said Y.C. Chen, associate vice president of ASUS Group. “Additionally, the compact form factor and 2TB density allow us to create class-leading thin and light devices.”

  The Micron 2500 SSD is breaking new ground as the world’s first QLC SSD that approaches PCIe® Gen 4 theoretical saturation performance, boasting up to 7.1 GB/s sequential read speeds. It outperforms TLC-based NAND and QLC-based NAND SSDs in the value segment, with superior performance to competitor offerings: 4

  Micron 2500 SSD performance
  Performance Metric	Versus TLC Client SSDs	Versus QLC Client SSDs
  Sequential read	Up to 48% better	Up to 72% better
  Sequential write	Up to 32% better	Up to 97% better
  Random read	Up to 38% better	Up to 131% better
  Random write	Up to 25% better	Up to 85% better

  
  Enhancing the performance of the Micron 2500 SSD is its accelerated caching feature which ensures the fastest read and write performance under most applications. The Micron 232-layer QLC NAND enables a robust SSD write endurance specification. Even the smallest capacity Micron 2500 512GB SSD has enough endurance to support thirteen 4K movie downloads per day, every day for three years.5

  The Micron 2500 SSD is available in 22 x 30mm, 22 x 42mm and 22 x 80mm form factors, in 512GB up to 2TB capacities. Notably, it features a compact 2TB 22 x 30mm option that is perfect for handheld gaming devices. The single-sided design of these SSDs provides greater flexibility for OEMs to integrate into systems that range from ultra-thin devices to workstations. For more information, visit: www.micron.com/2500.

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  3 PCMark 10 testing in Micron labs using the Full System Drive Benchmark. For details see: https://benchmarks.ul.com/pcmark10. Competitive value SSDs tested as noted in footnote 1.
  4 Performance comparisons are based on publicly available data sheet information per footnote 1.
  5 Estimated 14GB per 2-hour 4K movie. The Micron 2500 (512GB) is rated for 200TB TBW (total bytes written), which provides enough endurance for a daily average of over 182 GB per day of data written over its 3-year warranty. The 1TB and 2TB capacities have higher TBW ratings respectively.

• Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI (Apr 17, 2024)

  Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings

  BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024. This milestone positions Micron at the forefront of the industry, empowering artificial intelligence (AI) solutions with HBM3E’s industry-leading performance and energy efficiency.

  HBM3E: Fueling the AI Revolution
  As the demand for AI continues to surge, the need for memory solutions to keep pace with expanded workloads is critical. Micron’s HBM3E solution addresses this challenge head-on with:

  • Superior Performance: With pin speed greater than 9.2 gigabits per second (Gb/s), Micron’s HBM3E delivers more than 1.2 terabytes per second (TB/s) of memory bandwidth, enabling lightning-fast data access for AI accelerators, supercomputers, and data centers.
  • Exceptional Efficiency: Micron’s HBM3E leads the industry with ~30% lower power consumption compared to competitive offerings. To support increasing demand and usage of AI, HBM3E offers maximum throughput with the lowest levels of power consumption to improve important data center operational expense metrics.
  • Seamless Scalability: With 24 GB of capacity today, Micron’s HBM3E allows data centers to seamlessly scale their AI applications. Whether for training massive neural networks or accelerating inferencing tasks, Micron’s solution provides the necessary memory bandwidth.

  “Micron is delivering a trifecta with this HBM3E milestone: time-to-market leadership, best-in-class industry performance, and a differentiated power efficiency profile,” said Sumit Sadana, executive vice president and chief business officer at Micron Technology. “AI workloads are heavily reliant on memory bandwidth and capacity, and Micron is very well-positioned to support the significant AI growth ahead through our industry-leading HBM3E and HBM4 roadmap, as well as our full portfolio of DRAM and NAND solutions for AI applications.”

  Micron developed this industry-leading HBM3E design using its 1-beta technology, advanced through-silicon via (TSV), and other innovations that enable a differentiated packaging solution. Micron, a proven leader in memory for 2.5D/3D-stacking and advanced packaging technologies, is proud to be a partner in TSMC’s 3DFabric Alliance and to help shape the future of semiconductor and system innovations.

  Micron is also extending its leadership with the sampling of 36GB 12-High HBM3E, which is set to deliver greater than 1.2 TB/s performance and superior energy efficiency compared to competitive solutions, in March 2024. Micron is a sponsor at NVIDIA GTC, a global AI conference starting March 18, where the company will share more about its industry-leading AI memory portfolio and roadmaps

• Micron Releases ‘What Makes Us Micron’ 2023 Diversity, Equality and Inclusion Report (Apr 17, 2024)

  BOISE, Idaho, March 05, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced the release of its sixth annual diversity, equality and inclusion (DEI) report, “What makes us Micron.” This publication details the company’s progress in meeting its five DEI commitments,* underscoring the pursuit of an inclusive culture that supports a diverse workforce essential for nurturing innovation and business success.

  “Micron is focused on cultivating a work environment where diverse perspectives and backgrounds combine to create innovative solutions to challenging technology problems,” said Micron President and CEO Sanjay Mehrotra. “This report showcases our advancements, our learnings and our vision for building an agile semiconductor workforce for the future that reflects the diverse world around us.”

  In the past year, despite facing one of the most significant downturns in the memory and storage industry’s history, Micron remained dedicated to expanding access and opportunities for all. The company’s proactive approach is evident through its 10 actively engaged employee resource groups (ERGs), which saw membership grow to more than 47% among its global workforce in fiscal year 2023.

  “This impressive engagement underscores the vibrant, supportive community Micron fosters,” said Vice President and Chief Diversity Inclusion Officer Fran Dillard. “Members of Micron's ERGs play a pivotal role as influential ambassadors in creating an inclusive culture for all, ensuring every team member feels valued and empowered to contribute their best ideas and work.”

  STEM education and diverse talent development initiatives

  Micron is at the forefront of making education and careers in engineering more accessible, breaking down barriers to entry in the semiconductor field. By investing in science, technology, engineering and math (STEM) education for K-12 and supporting traditional and nontraditional pathways into the industry, Micron aims to create a talent ecosystem that is more diverse and inclusive. Through the Micron Foundation initiatives, programs such as Chip Camp, Girls Going Tech, Careers in a High-Tech World and Chip Camp Junior aim to inspire students from underrepresented groups and rural backgrounds to explore STEM careers for the future.

  In 2023, Micron doubled its K-12 STEM outreach programs by expanding its Chip Camp globally with new offerings in Taiwan, China, Singapore and Japan, where the foundation partnered with the Girl Scouts of Japan to host the first Chip Camp for Girl Scouts. Micron took a significant step toward inclusivity by hosting its STEM programming in Central New York, where, through a collaboration with La Liga Spanish Action League and Onondaga Community College, the Girls Going Tech forum was conducted entirely in Spanish, demonstrating Micron’s commitment to engaging students from diverse backgrounds.

  Micron’s efforts include forming partnerships to support underrepresented groups with organizations like the EDGE Consortium, National Society of Black Engineers, Society of Hispanic Professional Engineers, and Society of Women Engineers. Micron is also helping veterans transition seamlessly to a civilian career through strategic partnerships with Syracuse University’s D’Aniello Institute for Veterans and Military Families (IVMF); programs associated with branches of the U.S. government such as SkillBridge, HIRE Vets Medallion Program and Hiring our Heroes; as well as with veteran organizations in the areas where we will be hiring. In addition, Micron launched the U.S.-Japan University Partnership for the Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future, as well as the Northwest, Northeast and minority-serving institution (MSI) university semiconductor networks. Together these programs focus on preparing a workforce that is ready for the semiconductor industry, conducting essential research and enhancing educational collaboration.

  Reinforcing its commitment to diverse financial institutions

  In addition to strengthening DEI internally, Micron partnered with businesses in key areas to build a more inclusive economy while supporting underrepresented communities. In fiscal year 2023, the company achieved its goal of growing fixed income investments managed by diverse financial institutions to $750 million. Micron conducted financial transactions with community development financial institutions (CDFIs) and included diverse financial institutions as underwriters in the issuance of $3.5 billion of debt to further demonstrate its dedication to societal growth. These actions align with Micron’s DEI commitment to invest in diverse financial institutions and ensure underrepresented communities have access to capital.

  Awards and recognitions for its DEI efforts in 2023

  Micron received noteworthy recognition from prestigious organizations last year, highlighting its commitment to creating inclusive and accessible workplaces around the world. The company was featured on Newsweek’s America’s Greatest Workplaces for Diversity in 2023, acknowledged in Bloomberg’s Gender Equality Index, received a gold award for Micron Japan’s DEI and LGBTQ+ activities by Pride Index Association and listed among Forbes Top Companies for Women in 2023. Micron also scored 100 on the Disability Equality Index and the Human Rights Campaign’s Corporate Equality Index in 2023.

  The full Micron report, titled “What Makes Us Micron: 2023 DEI Report,” can be found at www.micron.com/dei.

• Micron First to Market With LPDDR5X-based LPCAMM2 Memory, Transforming User Experiences for PCs (Apr 17, 2024)

  Higher performance, better power consumption, smaller form factor LPCAMM2 memory enables faster, lighter, smaller notebooks with longer battery life and modularity for serviceability and upgrades

  BOISE, Idaho, Jan. 09, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today unveiled the industry’s first standard low-power compression attached memory module (LPCAMM2) available in capacities from 16GB to 64GB, which delivers higher performance, energy-efficiency, space savings and modularity for PCs. Sampling now with production in the first half of 2024, LPCAMM2 is the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997. Micron’s LPDDR5X DRAM incorporated into the innovative LPCAMM2 form factor will provide up to 61% lower power1 and up to 71% better performance for PCMark® 10 essential workloads such as web browsing and video conferencing,2 along with a 64% space savings over SODIMM offerings.3

  As generative artificial intelligence (GAI) use cases proliferate to client PCs, performance of the memory subsystem becomes more critical. LPCAMM2 delivers the required performance to process AI workloads on PCs and provide the potential to scale to applications needing a high performance and low power solution in a compact and modular form factor, with the ability to upgrade low power DRAM for the first time, as customer needs evolve.

  “Micron is transforming the laptop user’s experience with the LPCAMM2 product that will deliver best-in-class performance per watt in a flexible, modular form factor,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “This first-of-its-kind product will enhance the capabilities of AI-enabled laptops, whose memory capacity can be upgraded as technology and customer needs evolve.”

  Micron’s leadership in JEDEC and collaboration with key client PC OEMs and ecosystem enablers helped design and develop the LPCAMM2 form factor. Beyond product development, delivering this new type of memory has involved numerous innovations for test hardware, testing methodologies and automation technologies that will enable an efficient production ramp. Additional benefits of Micron’s LPCAMM2 include:

  • Higher performance with LPDDR5X to achieve speeds up to 9600Mbps versus 5600Mbps with current DDR5 SODIMMs4
  • Up to 80%5 system standby power savings to improve battery life
  • Up to 7% better performance for digital content creation workloads6
  • Up to 15% improvement for productivity workloads in PCMark 10 tests6
  • Modularity to enable critical serviceability functionality for enterprise IT users and administrators
  • Single PCB for all module capacities to provide supply chain flexibility to OEM and ODM customers
  • Simplified motherboard routing complexity compared to SODIMM
  • Crucial LPCAMM2 retail products allow laptop PC users the ability to upgrade their system memory configuration

  “LPCAMM2 is a dynamic new form factor for the PC ecosystem that enables higher performance, scalable memory capacity, and improved battery life for mobile workstations and thin and light laptops,” said Yasumichi Tsukamoto, executive director and distinguished engineer, Commercial Product Solutions Development at Lenovo. “We are proud of our strong relationship and joint development effort with Micron to be one of the first to market in bringing this flexible memory offering to our customers. In addition to the enhanced user experience, the low power memory used in these modules aligns with our goals to reduce energy consumption in our laptops.”

  “Intel and Micron, in close collaboration with key industry PC leaders, are reimagining the client PC space through the development of optimized new platform designs, powered by Micron’s LPCAMM2 form factor. The technical advantages of LPCAMM2 technology enable Intel and its ecosystem partners to advance sustainable low-power memory technology solutions and exciting new PC designs for the age of the AI PC,” said Dr. Dimitrios Ziakas, vice president of Memory and IO Technology at Intel. “We remain committed to our collaboration with the ecosystem, paving the path for future adoption and innovation.”

  “The use of large language models and AI applications on edge devices like laptops and mobile workstations is a key focus area for our future customer-focused designs,” said Andy Lee, senior vice president of Compal. “Compal is working closely with Micron to design platforms that are going to fuel the AI revolution based on the high bandwidth, low power, and high-capacity capabilities of Micron’s LPCAMM2 memory solutions.”

  Micron will also offer end customers Crucial LPCAMM2 memory offerings to provide laptop users like gamers, on-the-go professionals and content creators with the ability to upgrade their memory themselves, an industry first for low-power memory due to the upgradeable design of this new form factor. Crucial LPCAMM2 products will be available in the first half of 2024 on www.crucial.com. To learn more about the innovative features and advantages of Micron’s LPCAMM2 offering, visit: www.micron.com/LPDRAM.

• Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles (Apr 17, 2024)

  Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers

  NUREMBERG, Germany, April 10, 2024 (GLOBE NEWSWIRE) -- Embedded World -- Micron Technology, Inc. (Nasdaq: MU), today announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services. Micron’s low-power double data rate 5X (LPDDR5X) memory, Universal Flash Storage (UFS) 3.1, Xccela™ flash memory and quad serial peripheral interface NOR (SPI-NOR) flash have been pre-integrated for the latest generation of Snapdragon automotive solutions and modules, including the Snapdragon® Cockpit Platform, Snapdragon Ride™ Platform and Snapdragon Ride™ Flex System-on-Chip (SoC), all of which are intended to handle the increasing requirements of modern and future workloads for artificial intelligence (AI) technologies. This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.

  “Today’s software-defined vehicles and immersive cockpits require highly reliable, ultralow-latency memory and storage to process massive amounts of data at the edge and enable time-critical near-instant decision-making,” said Chris Jacobs, vice president of Micron’s embedded market segments. “Our broad portfolio of automotive memory and storage solutions provides the instant-on performance required on the road, and we’re thrilled to work with Qualcomm Technologies to accelerate ecosystem adoption of the leading-edge solutions designed to make vehicles safer and smarter.”

  Micron offers a wide portfolio of automotive-grade solutions with high reliability, fast boot times, high bandwidth, low power and a small footprint. Unlike many automotive-marketed solutions that are built for consumer devices, Micron’s automotive-grade products are uniquely ruggedized, built and optimized to meet demanding automotive standards through its process technology and product development. These automotive products are rigorously tested to provide the extreme stability, quality, thermal tolerances, reliability and longevity that the automotive market requires.

  Micron’s solutions are qualified for a range of Snapdragon Digital Chassis solutions that support a range of AI-driven features:

  • Snapdragon Cockpit Platform is designed for software-rich, personalized digital cockpits, supporting immersive audio, intelligent driving assistance and rich visual experiences across multiple displays. Equipped with high-performance computing and machine learning accelerators, the Snapdragon Cockpit Platform features multimodal generative AI capabilities and enables the development of digital cockpits that can intuitively adapt and evolve with driver needs and technological advancements.
  • Snapdragon Ride Platform enables advanced driver-assistance systems (ADAS) features and supports a range of functionalities from basic parking assistance to higher levels of autonomy and technologies such as computer vision, complex AI networks, camera visualization, sensor fusion, lidar perception, automated driving maps and ultrasonic sensor processing.
  • Snapdragon Ride™ Flex SoC is designed to support mixed-criticality workloads with central compute, integrating digital cockpit, ADAS and automated driving capabilities on a single chip. This centralization helps automakers achieve a unified software-defined vehicle architecture, paving the way for multimodal AI networks in automotive systems.

  Micron’s automotive solutions will deliver powerful benefits for Qualcomm Technologies’ automotive customers and the broader ecosystem:

  • Micron’s automotive LPDDR5X is the flagship memory solution for applications needing the fastest speeds and lowest power profile. LPDDR5X enables improved energy efficiency and performance for intelligent vehicles with increasingly bandwidth- and energy-hungry technologies such as AI-based autonomous driving features. Notably, Micron’s LPDDR5X is backward-compatible for LPDDR5 speeds of 6.4 gigabits per second, which Qualcomm Technologies has qualified the memory for. With this qualification, Qualcomm Technologies’ latest generation Snapdragon automotive SoCs are the first SoC family enabling the LPDDR5 interface.
  • Micron’s automotive UFS 3.1 storage enables two times faster read performance and a 50% improvement in sustained write performance,1 enabling faster startups and over-the-air updates, more responsive launching of applications and an overall smoother user experience. This boost in speed brings the driver experience in line with the expectations of consumers who have little tolerance for latency while on the road, especially when accessing critical data such as directions from their digital cockpit.
  • Micron’s Xccela™ flash memory is one of the industry’s highest-performance NOR flash memories, delivering five times the performance and reducing energy consumption by three times.2 This capability enables instant-on performance and fast system responsiveness in automotive applications.
  • Quad SPI-NOR flash delivers fast code execution and high reliability for applications such as boot code and program code. This is especially critical for scenarios such as reliably booting up a vehicle’s digital cockpit and operating system as soon as a driver starts the engine, as code failure may result in cars being “bricked” or rendered inoperable.

  These Micron solutions have been enabled in all the volatile and nonvolatile memory sockets of the latest generation Snapdragon Cockpit Platforms. The companies’ work builds on a long-standing working relationship that spans multiple generations of platforms between Micron and Qualcomm Technologies to bring immersive in-vehicle experiences to cars. With this qualification, Micron and Qualcomm Technologies together help the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.

  Used by leading automakers, Micron’s automotive solutions have accumulated trillions of miles on the road3 over the company’s nearly 35 years in the automotive market. Micron’s deep expertise stems from tight collaboration with automotive customers on designing memory into evolving architectures underpinning cutting-edge automotive technologies.

  This announcement complements Micron’s unveiling of the Micron 4150AT SSD at Embedded World in Germany this week. Offering first-of-its-kind virtualization, and four customizable ports, the automotive-grade drive enables a new paradigm of centralized architectures for intelligent vehicles. Together, these launches extend Micron’s automotive leadership and better empower the automotive ecosystem to usher vehicles into a new era of intelligence at the edge.

  Resources

  • Portfolio page: Automotive memory and storage solutions

  Snapdragon, Digital Chassis, and Snapdragon Ride are trademarks or registered trademarks of Qualcomm Incorporated.
  Snapdragon, Snapdragon Digital Chassis, Snapdragon Ride, and Snapdragon Ride Flex are products of Qualcomm Technologies, Inc. and/or its subsidiaries.