Hwa Shu Enterprise Co., Ltd.

• Booth: 3426

Overview

Found in 1982, Hwa Shu Enterprise Co. Ltd. specializes in precision mold fabrication and plastic injection molding. In the early days, it focused on the design and production of diverse consumer plastic injection molds and plastic products. After successful development of IC Tray and mass production in 1992, it has entered the packaging material supply chain of semiconductor packaging and testing industry and has expanded rapidly ever since, accompanied with the growth of Taiwan IC packaging and testing industry.

In 1998, we established the embossed carrier tape production line, and Tape & Reel has successively obtained the recognition from domestic and foreign major IC packaging and testing plants. In 2003, we successfully developed the production of chip tray again and set up a complete product portfolio of IC carrier package. Over 30 years, Hwa Shu has become one of leading providers of global IC Tray, Tape & Reel and Chip Tray and other products. The distribution of customers covers Taiwan, China, Japan, Korea, Singapore, Malaysia, Philippine and Thailand, and we have service offices in Singapore and Japan. 

  Press Releases

• About HWA SHU (Mar 11, 2024)

  Found in 1982, Hwa Shu Enterprise Co. Ltd. specializes in precision mold fabrication and plastic injection molding. In the early days, it focused on the design and production of diverse consumer plastic injection molds and plastic products. After successful development of IC Tray and mass production in 1992, it has entered the packaging material supply chain of semiconductor packaging and testing industry and has expanded rapidly ever since, accompanied with the growth of Taiwan IC packaging and testing industry.

  In 1998, we established the embossed carrier tape production line, and Tape & Reel has successively obtained the recognition from domestic and foreign major IC packaging and testing plants. In 2003, we successfully developed the production of chip tray again and set up a complete product portfolio of IC carrier package. Over 30 years, Hwa Shu has become one of leading providers of global IC Tray, Tape & Reel and Chip Tray and other products. The distribution of customers covers Taiwan, China, Japan, Korea, Singapore, Malaysia, Philippine and Thailand, and we have service offices in Singapore and Japan. 

  Vision and Mission

  Vision

  We have committed to becoming the leading brand of the IC Tray, Chip Tray, Tape & Reel, Heat spreader and other products in the global semiconductor packaging and testing industry,

  Mission

  We will uphold the spirit of continuous innovation to provide quality products and services, and to work with customers to create a win-win.

  Management Philosophy

  • Emphasizing on commitment and striving to achieve customer satisfaction.
  • Realistic, True-seeking, Continuous improvement, Pursuing excellence
  • Actively innovation, Value the talented, and Pursue business sustainability

• Profession, Quality, Service (Mar 11, 2024)
  For nearly 20 years, Hwa Shu has been developing and manufacturing IC Tray, Tape and Reel needed by semiconductor packaging and testing industry, with main customers all being large global semiconductor packaging and testing manufactures. IC tray, Tape and Reel and other products are mainly used to carry, protect, and transport IC or electronic components, and to enable their accurate smooth operation on related equipment. In particular, for IC Tray, it must to ensure against deformation in the process of high-temperature backing with IC. Thus, from the beginning of product and mold design, all go through comprehensive consideration and simulation as well as precise control, so that we ensure the product quality reaches customers’requirements.

• Product Diversification (Mar 11, 2024)
  With the most extensive experience of product design and manufacturing, Hwa Shu provides customers complete portfolio of products and services. We already have thousands sets of molds in IC Tray, Chip Tray, and Embossed Carrier Tape. To satisfy new product demands of customers, we continue developing new designs and new molds each year to meet wide range of customers’ package types or new.

• Customer orientation; Vertical integration (Mar 11, 2024)
  With significant increase in demand for mobile communication in recent years, customers require more diversification and more CSP, smaller packaging, higher product precision and operation stability, and the schedule of project development becomes shorter. Through the integration of product design, standardization of mold design and manufacturing and high-speed precision CNC machining and production, new product development schedule is shortened to meet customers requirement of quality and delivery.

  Products