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SUSS MicroTec Solutions GmbH & Co. KG

Garching,  Germany
http://www.suss.com
  • Booth: 1725

SUSS MicroTec a leading supplier of Process Equipment

Overview

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. For more information, please visit www.suss.com


  Press Releases

  • Garching, March 27, 2024 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry, today publishes its Annual Report 2023 with final, audited financial figures for the past fiscal year. The preliminary and unaudited key figures for the fiscal year 2023 announced on February 29, 2024 are confirmed without exception.

    Order intake based on continuing operations, i.e. excluding the sold MicroOptics business, reached a record level of € 420.5 million (previous year: € 411.0 million). At € 296.4 million (previous year: € 279.7 million), the Advanced Backend Solutions division accounted for the largest share of new business. The biggest growth driver was the bonder business, which more than doubled its order intake to € 156.8 million (previous year: € 76.6 million). This strong order momentum was driven by capacity expansions for the production of microchips used in Artificial Intelligence (AI) applications. Order intake for lithography solutions decreased significantly to € 139.6 million (previous year: € 203.0 million), triggered by more cautious investment behavior of chip manufacturers in the current semiconductor industry cycle. Order intake in the Photomask Solutions division reached a strong level of € 124.1 million in fiscal year 2023, just missing previous year's record level of € 130.9 million. The order book of the continuing operations as of December 31, 2023 amounted to € 452.5 million, reaching a new record level (December 31, 2022: € 335.4 million). "The capacity utilization of our production sites will therefore be very high in 2024 and partly also in 2025, especially for bonders and in the Photomask Solutions division," says Dr. Thomas Rohe, Chief Operations Officer at SUSS MicroTec.

    Sales from continuing operations increased by 17.0% to € 304.3 million (previous year: € 260.0 million). The Photomask Solutions division made the largest contribution to group growth with an increase in sales of € 40.9 million or 83.8% to € 89.7 million (previous year: € 48.8 million). The main reasons for this were the execution of the high order book and the significant easing of supply chains constraints. In the Advanced Backend Solutions division, sales increased in absolute terms by € 3.8 million to € 214.7 million (previous year: € 210.9 million). Here, too, the bonders developed very positively with growth of 47.7% to € 51.7 million (previous year: € 35.0 million). The positive order development in the fiscal year 2022 and in the first half of 2023 contributed to this significant increase in sales. In contrast, sales in the lithography business decreased by -7.3%.

    The gross profit margin from continuing operations reached 34.1% (previous year: 38.7%) and was impacted by an unfavorable product mix and expenses to increase production capacity to fulfil the very positive order intake. EBIT from continuing operations amounted to € 27.8 million, down € 3.7 million from € 31.5 million in the previous year due to increased R&D and transformation expenses. Consequently, the EBIT margin reached 9.1% (previous year: 12.1%). However, with an EBIT margin of 14.6%, Q4 was the most profitable quarter of the year.

    Net income for the year amounted to € 4.7 million (previous year: € 24.5 million). The decrease was mainly due to the result from discontinued operations of € -12.6 million. This included a negative result from the MicroOptics division and expenses of € 4.4 million in connection with the sale of the subsidiary SUSS MicroOptics S.A., which was completed in January 2024 and already had been recognized in the previous fiscal year.

    The Management Board and the Supervisory Board will propose to the Annual General Meeting on June 11, 2024 to distribute an unchanged dividend of € 0.20 per share. This would result in a total payout of € 3.8 million and a payout ratio of approximately 50% of the free cash flow from continuing operations. Overall, i.e. including the MicroOptics division, the free cash flow amounted to € -4.4 million. "We are thus deviating from our dividend policy of paying out 20 to 40% of free cash flow. The reason for this is that in SUSS MicroTec's anniversary year – in 2024 we are celebrating our 75th anniversary and our 25th anniversary as a listed company – we want our shareholders to participate in the success of the sale of the MicroOptics business, even though the extraordinary income will not be realized until fiscal year 2024," explains Dr. Cornelia Ballwiesser, CFO of SÜSS MicroTec SE.

    Outlook

    Provided no unexpected deterioration in the global economy in general and the semiconductor or semiconductor equipment market in particular, and provided the Company is not again impacted by increased administrative efforts and delays in export approvals for shipments to China, management expects full year 2024 sales to be in a range of € 340 to 370 million. The midpoint of this range would represent a growth rate of 16.7%. "We expect the largest growth contribution to come from our bonder business, which has recently been very strong in terms of orders and where we are benefiting from the substantial capacity expansion of AI related chip production," says Burkhardt Frick, CEO of SUSS MicroTec.

    Management generally expects the gross profit margin to improve in 2024. The expected higher sales volume is likely to ensure a better coverage of fixed costs. The product mix of the system shipments planned for 2024 should also have a positive impact on the margin development. At the same time, SUSS MicroTec is undergoing a growth transformation, which is associated with costs. Taking all factors into account, the gross profit margin is expected to be in a range of 35 to 38% in fiscal year 2024. The midpoint of this range would represent an improvement of 2.4 percentage points compared to the gross profit margin of 34.1% in fiscal year 2023.

    The higher level of sales and the associated economies of scale are expected to also have a positive impact on EBIT. At the same time, higher expenses will be required for research and development and transformation-related expenses in production, sales and administration. Overall, the company expects an EBIT margin in the range of 10 to 12%. Non-operating extraordinary income of approximately € 58 million will also be realized from the sale of the MicroOptics business, which was completed in January 2024.

    The 2023 Annual Report is available for download at www.suss.com/en/investor-relations in German and English language.

  • Garching, March 15, 2024 – SÜSS MicroTec SE, a leading manufacturer of system and process solutions for the semiconductor industry, will be listed in the TecDax with effect from Monday (March 18, 2024). This decision was announced by Deutsche Börse via its index provider Qontigo. SUSS MicroTec is thus once again one of the 30 largest German technology companies based on free float market capitalization. The company had previously been removed from the TecDax in 2016.

    "We are very pleased that the capital markets have recognized our positive business development in recent quarters and that we are supporting the world's most important technological megatrends," says Burkhardt Frick, CEO of SUSS MicroTec. "Currently, the main driver of our order intake is the enormous capacity expansion in semiconductors for AI applications. However, our solutions are also used in e-mobility, data centers, cloud computing and other applications.”

  • Hanau/Garching, 5 March 2024 – Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

    Heraeus Printed Electronics, the worldwide only provider of a turnkey solution for digital inkjet printing on electronic components, offers metallic inks, deep process knowledge and printing systems. It complements the broad product portfolio of Heraeus to the electronics industry. The Prexonics® technology enables selective printing on different substrates for a wide range of applications such as shielding against electromagnetic interference (EMI), printing of conductive structures and metallization for heat dissipation.

    "This collaboration represents the missing piece in the mosaic of scaling to mass production for us, having recently passed the important milestone of fulfilling the broad functional requirements of the semiconductor industry with our ground-breaking technology," said Franz Vollmann, Head of Heraeus Printed Electronics. "By combining our core expertise in metallic specialty inks and digital printing processes with the scaling competence of our strong partner SUSS MicroTec, we are setting a new industry standard for mass production in the semiconductor market."

    SUSS MicroTec, known for its advanced equipment and process solutions for semiconductor manufacturing, brings its leading-edge automation platform and industrial inkjet production capabilities to the table. Their high-volume production equipment, JETx, designed to integrate various printhead and substrate technologies, expands the application potential of Heraeus' digital printing technology. SUSS MicroTec´s high production capacity and excellent global sales and service network support the smooth transfer of the solution into high-volume manufacturing.

    "The integration of Heraeus' breakthrough ink technology and digital printing capabilities with our robust automation platforms is a testimonial to our pursuit of excellence and innovation. We are confident that our combined efforts will result in unprecedented production efficiencies and costs in line with current and future market expectations," said Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions of SUSS MicroTec.

    The scope of the collaboration calls for the development of equipment that integrates Heraeus' digital printing technology, image processing software and advanced ink technology into SUSS MicroTec's automation and JETx platform. The end goal is a state-of-the-art system with a competitive total cost of ownership (TCO) that not only sets new standards in the industry, but also aligns with Heraeus and SUSS MicroTec's vision of cost and performance optimization. The product of this partnership looks to redefine the boundaries of what is possible and push forward into a future where technology serves as the cornerstone for innovation and growth.


    About SUSS MicroTec
    SUSS MicroTec is a leading manufacturer of system and process solutions for micropatterning in the semiconductor industry and related markets. In close collaboration with research institutes and industry partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED production. With its global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. The headquarters of SUSS MicroTec is in Garching, near Munich, Germany. Additional information can be found at www.suss.com.

    About Heraeus
    The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. Today, Heraeus bundles diverse activities in the Business Platforms Metals and Recycling, Healthcare, Semiconductor and Electronics as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership. In the 2022 financial year, the group generated revenues of €29.1 billion (US$30.6 billion) with approximately 17,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets. Explore our turnkey solution at www.heraeus-printed-electronics.com.


  Products

  • ACS200 Gen3 Coater & Developer
    ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM)....

  • The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.

    With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.

    Different I/O systems match with any need. The 2x I/O serves R&D requirements, whereas the new designed auto load cassette station enables a continuous operation without stopping the system for cassette exchange.

    The coater bowl offers state of the art open bowl coating and the patented GYRSET® closed cover coating technology. The bowl design offers the possibility to use disposable process bowls for operation without compromising in flow dynamics or exhaust flows. It simplifies operation with inconvenient or unusual materials due to easy cleaning of the bowl and reduced maintenance time. The possibility to separate the solvent and resist lines on 2 different dispense arms per coater module, the ACS200 Gen3 follows consequently the path on providing excellent yield.

    For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement.

    The direct connection to a SUSS exposure system increases yield as no operator interaction is necessary for a complete lithography process flow.

    Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.

  • XBS200 Wafer Bonder
    Wafer Bonding Platform for High-Volume Production...

  • The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.
  • XBS200 Wafer Bonder
    Wafer Bonding Platform for High-Volume Production...

  • The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.
  • MA/BA Gen4-Serie Mask- und Bond-Aligner
    Compact Aligner Platform for Research and Low-Volume Production...

  • The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner and introduces a new platform system. The two platform types differ in configuration, and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series dedicated to advanced and high-end processes.

    The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production.

    SUSS MicroTec’s MA/BA Gen4 series is setting a new benchmark in full-field lithography for academia, MEMS & NEMS, 3D integration and compound semiconductor markets. It is also prepared to handle processes like bond alignment, fusion bonding and SMILE imprinting.

    Processes developed on the MA/BA Gen4 series can be quickly transferred onto SUSS MicroTec‘s automated mask alignment platforms for high-volume production.

  • LP50
    Advanced research inkjet printer...

  • SUSS LP50 inkjet printer with PiXDRO technology is designed for research and development of inkjet processes and applications.

    The SUSS LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for the research and development of inkjet processes and applications, as well as the evaluation and development of inkjet materials.

    The SUSS LP50 platform is an open, accurate, flexible, and easy-to-use system that will allow you to work at the cutting edge of inkjet printing technology. It is designed for a wide range of applications such as semiconductor packaging, PCBs, printed electronics, photovoltaics, displays, and biomedical.

  • HMxSquare
    The HMxSquare is designed to address the needs of customers in the semiconductor industry requiring high quality substrate processing for photomask applications as well as opto-electronics, OLED, and special semiconductor back-end (MEMS) applications....

  • The HMxSquare is designed to address the needs of customers in the semiconductor industry requiring high quality substrate processing for photomask applications as well as opto-electronics, OLED, and special semiconductor back-end (MEMS) applications. It offers develop, etch and cleaning functionalites.

    The HMxSquare enables processing of small series or pilot production of special substrate. The system is loaded manually. All further process steps are automated. Thereby, HMxSquare combines stability and reliability of the proven performance of the original HMx series platform with today’s needs for electronic control functions, implementation of new cleaning techniques and environmental and safety requirements.

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