DR Laser Singapore Pte Ltd

Our product utilizes Laser Accelerated Controlled Etching (LACE) technology to create large numbers of through-holes on glass substrates, that will undergo coating and metallization to achieve electrical conductivity between the top and bottom layers, which can be used in semiconductor and electronics packaging.

LACE is a subtractive fabrication technique which consists of two-steps: laser modification, followed by wet chemical etching. During the modification process, ultrafast laser is employed to induce phase changes in selective regions of the glass material. In subsequent chemical etching process, these phase-changed regions exhibit high etching efficiencies which leads to the formation of through-holes that are crack-free.

Our product utilizes Laser Accelerated Controlled Etching (LACE) technology to create large numbers of through-holes on glass substrates, that will undergo coating and metallization to achieve electrical conductivity between the top and bottom layers, which can be used in semiconductor and electronics packaging.

LACE is a subtractive fabrication technique which consists of two-steps: laser modification, followed by wet chemical etching. During modification process, ultrafast laser is employed to induce phase changes in selective regions of the glass material. In subsequent chemical etching process, these phase-changed regions exhibit high etching efficiencies which leads to the formation of through-holes.

DR Laser’s LumaQuant Series redefines MicroLED mass transfer, offering flexible configurations with excimer or DPSS laser systems to meet the diverse demands of modern manufacturing. Built around a non-contact, selective transfer process, LumaQuant ensures high positional accuracy and consistent process quality across a wide range of chip sizes and layouts.

Key Features:

• Selective, non-contact laser transfer
• DR Laser proprietary coaxial vision platform
• Automatic gap adjustment
• High precision and repeatability: delivers ±1 μm placement accuracy and sub-micron repeatability through closed-loop gantry control and real-time feedback.

LumaFusion combines laser-assisted selective soldering technology with precision mechanical contact to create strong, reliable bonds between micro-scale components and temperature-sensitive substrates.

Key Features:

• Selective, High-Precision Laser Soldering
• Fully Automated Handling
• Integrated Vision Alignment System
• Contact Force Feedback and Parallelism Control
• Flexible Process Customization

DR Laser’s Kleave series is equipped with precision motion control and advanced laser processing technology to perform high-accuracy wafer dicing. Designed for superior cutting quality and process reliability, it prepares wafers for downstream expansion and backend operations. The equipment delivers a versatile and high-efficiency laser cutting solution tailored to the demands of modern semiconductor manufacturing.

Key Features:

• Supports wafer sizes of wide range and thicknesses
• Suitable for various substrates including sapphire, silicon, silicon carbide, lithium tantalate, and more
• High positioning accuracy and repeatability
• Excellent cutting quality with high straightness, no chipping or cracks
• Minimal damage zone

DR Laser’s SILAI product line is designed to handle the processing of silicon carbide (SiC) boules into substrates and high-quality wafers with minimal kerf losses.

Key products:

• Step 1: Automatic visual inspection system
  
  This system accurately identifies the minor surface or doped regions of SiC boules to provide a laser processing coordinate framework. It enables a precise segmentation of doped/minor areas and the larger crystal surface, thereby reducing redundant dicing steps and significantly improving production efficiency and yield.
  
   
• Step 2: Laser slicing system
  
  This system is powered by a cutting-edge laser source and a precision optical path system. Our equipment creates a laser-modified layer essential for the slicing process. By controlling the thickness of layer thickness, process efficiency and overall throughput can be enhance with minimal impact on wafer performance.
  
   
• Step 3: Ultrasonic separation and cleaning system
  
  This system employs high-frequency ultrasonic vibration to achieve fast and complete material separation, significantly reducing delamination time. It supports precise parameter control for processing with minimal damage and features self-cleaning during separation to streamline the workflow. Its wide compatibility allows efficient handling of materials across various sizes.
  
   
• Step 4 & 5: Boule grinding system
  
  This system is designed for high-efficiency mechanical grinding for the fast and uniform processing of boules. It utilizes advanced grinding techniques to ensure superior surface quality and flatness of the ingot.
  
   
• Step 4 & 5: Wafer grinding system
  
  This system enables precise control of wafer thickness while ensuring excellent flatness and parallelism. With high grinding speed and optimized processes, it supports wafers of various sizes and materials. Featuring automatic loading/unloading and multi-step programmable operation, the system offers exceptional stability, reliability, and user-friendly performance.