NDS

Resin Bond Blade

Resin bond blades feature excellent free-cutting and self-sharpening properties, making them ideal for enhancing cut quality and efficiency. They perform exceptionally well on ductile and gummy materials such as QFNs and copper, as well as on hard and brittle materials like glass and ceramics.

Electro-Formed Nickel Bond Blade

Characterized by its ultra-thin profile, high strength, and stiffness, the electroformed nickel bond blade offers exceptional rigidity. It delivers high endurance and robust  performance during cutting while maintaining a very low wear rate.

Metal Bond Blade

Metal bond blades are sintered and mold-pressed under high temperature and pressure, resulting in high rigidity and extended blade life. With excellent wear resistance, a balanced wear profile, and increased stiffness, these blades effectively minimize cutting defects such as slant cuts and package size/profile variations—while delivering exceptional durability. 

New Metal Bond Blade For Dicing System-In-Package

Features
‧ Excellent cutting ability
‧ High blade stiffness
‧ Even blade wear
‧ Increasing blade lifespan
‧ Customized blade thickness

Heat-Resistant UV Dicing Tape

Unlike standard dicing tapes, this series features heat-resistant UV-curable adhesive that withstands processing temperatures up to 190°C.

UV Tape

Advanced Solutions for Controlled Adhesion

Our UV tape offers strong initial bonding with precise, clean release under UV light—ideal for applications demanding both secure attachment and easy detachment.

Non-UV Tape

Non-UV Tape for Semiconductor Manufacturing

A versatile and customizable adhesive solution designed to meet the specific needs of semiconductor manufacturing.
It offers reliable adhesion and protection, ensuring smooth handling and consistent performance across various process stages and material types.

Polyimide Tape

Polyimide Tape for High Performance Electronics

Our Polyimide Tape is a high-quality adhesive solution built to meet the demanding conditions of electronics manufacturing. With excellent thermal resistance, chemical stability, and clean removal, it ensures reliable performance in critical applications such as soldering, PCB masking, PCB reflow, and other high-temperature processes.

Thermal Release Tape

Thermal Release Tape for Semiconductor Manufacturing

Our Thermal Release Tape is specifically engineered for high-precision semiconductor applications, providing secure temporary bonding and effortless release under controlled heat conditions. With a wide range of release temperatures and excellent adhesion, it meets the rigorous demands of modern semiconductor processes.

Manual Wafer Mounter

Compatible with 6", 8", and 12" wafers, these manual mounters are designed for reliable, precise tape application in various wafer processing environments.

• Built-in linear roller system minimizes dust contamination
• Adjustable roller pressure for precise lamination control
• Durable, robust construction for long-term stability and performance

Wafer Cleaning System

Designed for 8" and 12" wafers, the NDS 408/412CSW-N is optimized for efficient cleaning and drying after dicing processes.

• For 8” / 12” wafers
• All-in-one cleaning and drying
• Rotary atomizing spray for uniform coverage
• Adjustable nozzle pressure & rotation speed
• Compact, cleanroom-ready design
• Ideal for post-dicing cleaning and tape residue removal

Polish Template

Optimized for Semiconductor Wafer Handling

Featuring a microporous inner layer, NDS polish template ensures strong and stable wafer adsorption throughout the polishing process. Compared to conventional designs, it offers improved wafer retention with reduced slippage, while still allowing smooth detachment post-polishing. This results in higher yield, less wafer damage, and better process reliability than standard competitor
models.

Polish Pad

Polish Pad for Advanced Semiconductor Applications

Engineered for high-precision planarization, NDS Polish Pad delivers consistent material removal rates (MRR) and exceptional surface uniformity—meeting the stringent requirements of advanced semiconductor wafer processing.

Grinding Wheel for SiC Wafer

Vitrified Bond

• Porous bond structure enables excellent grinding performance.
• Bond hardness can be precisely adjusted for optimal results.
• Enables ultra high-speed processing of hard-to-machine materials such as SiC.

Grinding Wheel for Si Wafer

BEST CHOICE FOR WAFER THINNING

Magic-Fiber

Revolutionary Eco-Solution: No Chemicals, No Power Required

Magic-Fiber is a chemical-free cleaning unit developed for cooling towers and chillers.
By utilizing mineral-enhanced fibers, it captures impurities and inhibits scale and algae buildup.

Magic-Tube

Nano bubbles. Massive impact.     1ml. 800 million nano bubbles.

Ultra-fine bubble-enriched water contains a vast number of microscopic bubbles that enhance oxygen absorption for bacteria and aquatic organisms.
Even as the bubbles become invisible over time, their beneficial effects remain unchanged.