Founded in 1978, Hesse GmbH is a world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto electronics and consumer electronics. Hesse GmbH designs and manufactures high speed fine pitch/fine wire wedge bonders, heavy wire bonders, smart welding machines and complementary equipment for semiconductor backend assembly.
For detail information, please visit our website: http://www.hesse-mechatronics.com/en/
Smart Welder
Smart Welder SW1085 combines the best technology of ultrasonic welding equipment and wire bonding machines.
Fine Wire Bonder
Bondjet BJ855 is benchmarked for large working area, high bonding speed and ball-wedge, wedge-wedge bonding capability.
Heavy Wire Bonder
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding ribbons for applications like power modules, IGBT, automotive devices, etc.
Laser Welder
LW1089 The Laser Welder LW1089 and LW2095 are laser welding systems for fully and semi-automatic deep penetration welding of aluminum and copper leads on DCB substrates, in power electronics, battery cells and modules, or other electronics manufacturing components.
More To Come
Detail explanations and demonstrations are available on-site with our professional team standing by to help. Welcome to visit us at #2509