C.C.P. Contact Probes Co., Ltd. (C.C.P.) introduces its next-generation Chip-scale Contact Probe solution to meet the advanced semiconductor test demands. This coaxial socket solution is specifically designed for leading semiconductor companies, offering more efficient and precise testing capabilities to meet the stringent validation requirements of AI, high-performance computing (HPC), and 5G chips.
Innovative Probe Technology Enhances Testing Performance
C.C.P.’s latest solution features an innovative structural design of coaxial socket, achieving higher contact reliability and low impedance characteristics. This significantly reduces test errors and signal loss. Additionally, the technology ensures stable testing for high-frequency and high-power chips, effectively extending probe lifespan and reducing testing costs.
C.C.P. will continue to innovate and collaborate with industry partners to provide the semiconductor industry with more competitive testing solutions, driving the development and application of next-generation chips.
For more information, please visit https://www.ccpcontactprobes.com to contact us.