Silrange wafers are essential substrates in semiconductor manufacturing, serving as the foundation for intergrated circuits(ICs), memory chips,and power devices. They are made from high-purity silicon using the Czochralski(CZ) or Float-Zone(FZ) method. Wafers range in diameter from 2inches(50mm) to 12 inches(300mm), with ongoing research into 18-inch(450mm) wafers for advanced applications.
Wafers undergo extensive processing, including slicing from silicon ingots, polishing, doping, oxidation, photolithography,and etching to create intricate circuit patterns. They are available in different types, including standard silicon wafers, Silicon-on-insulateor(SOl) wafers for high-performamce applications, and Silicon Carbide(SiC) or Gallium Nitride (GaN) wafers for power electronics and RF applications.
Key applications include microprocessors, memory (DRAM, NAND), automotive electronics, and 5G communication devices. With increasing demand for AI, IoT, and electric vehicles, wafer technology continues to evolve, focusing on higher purity,larger size, and advanced material integration.