Loading...

Jiangsu Jinggong Semicon Equipment Co., Ltd

Nantong,  Jiangsu 
China
https://www.jgsemicon.com/en/
  • Booth: B2343

Overview

Jiangsu Jinggong Semicon Equipment Co., Ltd. is located at Qidong City, Nantong City, Jiangsu Province. Products include Edge Grinding machine for 4-8 inches and 12 inch wafer, Single wafer cleaning machine,Single wafer brushing machine, Wafer waxing coating machine, Wafer edge profiler and etc.
With over 20 years of production and research and development experience, we can provide customers with diversified and customized Know-how solutions. Our equipment and technical capabilities have been proven in the industry and highly recognized by clients.

  Products

  • Wafer Edge Grinding Machine MET-5600
    Fully automatic, can process 4-6-8 inches various material wafer, such as Si, Ge,GaAs,lnP,SiC,GaN,LN/LT, bonded wafer, glass wafer and others....

    • Wafer Edge Grinding Machine MET-5600 is designed for compound semiconductor wafer materials with the characteristics of high precision, high-quality grinding surface, accurate crystal orientation positioning and easy operation.machines can process 4-6-8 inches various material wafer, such as Si, Ge,GaAs,lnP,SiC,GaN,LN/LT, bonded wafer, glass wafer and others.
  • Wafer Edge Grinding Machine MET-5800
    Wafer edge grinding Machine MET-5800 is designed for 12 inches semiconductor wafer materials with the characteristics of high precision, high-quality grinding surface, accurate crystal orientation positioning and stable operation....

    • Wafer edge grinding Machine MET-5800 is designed for 12 inches semiconductor wafer materialswith the characteristics of high precision, high-quality grinding surface, accurate crystal orientation positioning and stable operation. Machines can process 12 inches various material wafer.
  • Clean Robot JTX-2000
    Dual-arm multi-joint cleaning robot is for handling and transferring of wafer during the processing and inspection....

    • Dual-arm multi-joint cleaning robot is for handling and transferring of wafer during the processing and inspection. It is suitable for wafers of various sizes(2、4、6、8 and 12-inch) and features high precision, high stability, and high cleanliness. The product can be customized according to the shape, size, material of the wafers, and the production requirements.
  • Single Wafer Cleaning Machine QX-6800
    Single wafer cleaning Machine QX-6800 is designed for semiconductor wafer materials. By chemical solution cleaning, can effectively remove the particles, metal pollutants and other organic substances on the surface of wafer/epitaxial wafer....

    • Single wafer cleaning Machine QX-6800 is designed for semiconductor wafer materials. By chemical solution cleaning, can effectively remove the particles, metal pollutants and other organic substances on the surface of wafer/epitaxial wafer. The machine can process 4-6 and 6-8 inches various material wafer.Easily switch to process different size of wafer, no need to switch parts. Equipment cavity can be designed according to client's requirements.

Categories

207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 308 Materials, Substrate
  • Substrate Materials
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined
    For Technical Support with this webpage, please contact support.