Infineon Technologies Asia Pacific

Singapore,  Singapore
http://www.infineon.com

• Booth: W3409

Driving decarbonization and digitalization. Together.

Overview

Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization.

As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.

  Press Releases

• Infineon is the new market leader in the global microcontroller market (Apr 07, 2025)

  Munich, Germany – 10 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) takes over the number one position in the global microcontroller market. According to the latest research by Omdia [1], the company increased its market share to 21.3 percent in 2024 (2023: 17.8 percent), achieving the largest year-over-year gain (3.5 percentage points) among its competitors. This makes Infineon the most successful supplier of microcontrollers worldwide for the first time in the company’s history.

  “The fact that we have strengthened our position is proof of our superior product portfolio, software and easy-to-use development tools that exceed our customers’ expectations,” says Andreas Urschitz, Chief Marketing Officer and Member of the Management Board at Infineon. “Over the past decade, we have repeatedly outgrown the total market and gained market share by offering our customers highly functional and efficient system solutions that are at the heart of many innovations that drive decarbonization and digitalization.”

  Infineon outpaced the market over the past years. Since 2015, Infineon’s microcontroller business increased by an average of 13.0 percent per year, while the overall market grew by only 4.0 percent annually. In 2023, Infineon climbed to the global number one position in the market for automotive microcontrollers for the first time. Now, the company has achieved the same in the overall microcontroller market, all end markets combined. According to Omdia, the total market volume of global microcontroller sales in 2024 was $22.4 billion, after $28.0 billion in 2023.

  Microcontrollers act as the brains of numerous applications, from automotive systems that make cars clean, safe, and smart, to IoT devices that change the way we live, work and interact, and industrial machinery that drives productivity. Infineon's microcontroller portfolio addresses the needs of these applications with a variety of established product families, such as AURIX™, TRAVEO™, PSOC™, XMC™, and security microcontrollers.

  At Embedded World 2025, one of the leading international trade fairs dedicated to embedded systems technology, Infineon is showcasing its existing portfolio as well as an ambitious innovations roadmap. This includes, for example, the launch of a new automotive microcontroller family based on RISC-V under the AURIX brand within the coming years. This new family will extend Infineon’s existing core portfolio, which is based on TriCore™ and Arm®. Infineon is the first semiconductor company to announce a RISC-V-based microcontroller dedicated to the automotive market. The new family will address the complex computing requirements of software-defined vehicles.

  Furthermore, Infineon presents several innovations in its PSOC multi-purpose family, ranging from the latest advancements in Power and Motor Control with the new PSOC Control family to the enablement of CRA-ready Edge AI with PSOC Edge. Infineon also highlights the newest features of the PSOC 4 microcontroller family. By expanding leading capacitive sensing with all-new inductive and liquid sensing technologies in a single MCU, Infineon enables new use cases and a higher level of integration.

  [1] Based on or includes research from Omdia: Annual 2001-2024 Semiconductor Market Share Competitive Landscaping Tool – 4Q24. March 2025. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party’s own risk.

• Infineon advances Powering AI roadmap with cutting-edge Battery Backup Unit (BBU) technology for AI data centers (Apr 07, 2025)

  Munich, Germany – 12 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced its roadmap for next-level Battery Backup Unit (BBU) solutions for uninterrupted operations of AI data centers to avoid power outages and the risk of data losses. The comprehensive BBU roadmap includes power solutions from 4 kW up to the world’s first 12 kW battery backup unit. The BBU solutions are designed to deliver highly efficient, reliable, and scalable power conversion in AI server racks, and achieve a power density up to 400 percent higher compared to industry average. BBUs are essential for AI data centers to provide an uninterruptible power supply and furthermore protect sensitive AI hardware from voltage spikes, surges, and other power anomalies by filtering and conditioning the power that is supplied to the data center equipment. Combined with various best-in-class topologies enabling an increased ease-of-use for customers, the BBU solutions are bolstering Infineon’s leading position in the field of powering artificial intelligence.

  “Ensuring an uninterrupted power supply to AI systems is critical for maintaining process continuity and seamless operation,” said Adam White, Division President Power & Sensor Systems at Infineon. “Our energy efficient battery backup units are designed to keep AI servers running smoothly with exceptional performance, flexibility, and efficiency catering to the diverse power levels required by AI servers. By mastering all three relevant semiconductor materials silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) we are confident that Infineon semiconductor solutions will set a new standard in powering AI data centers.”

  Downtime or system failures in AI data centers can be extraordinarily costly, with 41 percent of firms interviewed in an ITIC survey from 2024 indicating losses from $1 million to over $5 million per hour of downtime. 35 percent of these failures are attributed to issues with power component quality. To address this, Infineon’s Partial Power Converter (PPC), a semiconductor solution that focuses on improving performance and reliability of power supply systems, stands out as a leading technology for battery backup units.

  The intermediate solution, represented by the 5.5 kW BBU, features an Infineon proprietary topology that integrates Si and GaN technologies providing ultra-high efficiency and high-power density. The industry-first 12 kW system combines several 4 kW power converter cards utilizing Infineon’s PSOC™ microcontrollers, 40 V and 80 V OptiMOS™ and EiceDRIVER™ Gate Drivers enabling unparalleled performance and flexibility, achieving a power density four times higher than industry average. Higher power levels can be attained by paralleling multiple cards on a motherboard, offering ease of scalability and simplified maintenance. If one card fails, the system continues to operate at a reduced capacity, minimizing downtime and ensuring high reliability. This modular approach allows the system to be tailored to specific power requirements without the need for a full system redesign creating substantial customer benefits in performance and reliability.

  To further demonstrate the capabilities of the latest BBU technology, Infineon is developing full system demonstrators for its battery backup solutions. These demonstrators will showcase the advantages of the PPC technology in real-world applications offering a clear path forward for next-generation AI data centers.

• Infineon reaches next milestone on 200 mm silicon carbide (SiC) roadmap: Product-roll out to customers starts (Apr 07, 2025)

  Munich, Germany – 13 February 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company will already release the first products based on the advanced 200 mm SiC technology to customers in Q1 2025. The products, manufactured in Villach, Austria, provide first-class SiC power technology for high-voltage applications, including renewable energies, trains, and electric vehicles. Additionally, the transition of Infineon's manufacturing site in Kulim, Malaysia, from 150-millimeter wafers to the larger and more efficient 200-millimeter diameter wafers is fully on track. The newly built Module 3 is poised to commence high-volume production aligned with market demand.

  “The implementation of our SiC production is progressing as planned and we are proud of the first product releases to customers,” said Dr. Rutger Wijburg, Chief Operations Officer of Infineon. “By ramping up SiC production in Villach and Kulim in phases, we are improving cost-efficiency and continuing to ensure product quality. At the same time, we are making sure our manufacturing capacities can meet the demand for SiC-based power semiconductors.”

  SiC semiconductors have revolutionized high-power applications by switching electricity even more efficiently, demonstrating high reliability and robustness under extreme conditions, and by making even smaller designs possible. Infineon’s SiC products let customers develop energy-efficient solutions for electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centers. The release to customers of the first SiC products based on the 200-millimeter wafer technology marks a substantial step forward in Infineon’s SiC roadmap, with a strong focus on providing customers with a comprehensive portfolio of high-performance power semiconductors that promote green energy and contribute to CO 2 reduction.

  As “Infineon One Virtual Fab” for highly innovative wide-bandgap (WBG) technologies, Infineon’s production sites in Villach and Kulim share technologies and processes which allow for fast ramping and smooth and highly efficient operations in SiC and gallium nitride (GaN) manufacturing. The 200-millimeter SiC manufacturing activities now add to Infineon’s strong track record of delivering industry-leading semiconductor technology and power system solutions and strengthen the company’s technology leadership across the entire spectrum of power semiconductors, in silicon as well as in SiC and GaN.

• Infineon and the BSI pave the way for a quantum-resilient future: World's first Common Criteria Certification for post-quantum cryptography algorithm on a security controller (Apr 07, 2025)

  Munich, Germany – 23 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a milestone on the way to a quantum-resilient world in collaboration with the German Federal Office for Information Security (BSI) [1]. Infineon is the first company ever to receive the Common Criteria EAL6, an industry-leading certification level, for the implementation of a post-quantum cryptography algorithm in a security controller. Such cryptography enhances security for eSIM, 5G SIM and smart card applications, including personal IDs, payment cards and eHealth cards, against threats resulting from highly capable quantum computers. The world's first certification is a milestone on the way to a quantum-safe future in our daily lives. 

  Within the next ten to twenty years, quantum computers are expected to become powerful enough to break current cryptographic algorithms, compromising the security of our digital lives. Documents like eIDs that currently being issued and are valid for many years need to be resistant against future attacks by quantum computers. The same is true of encrypted messages and emails that are sent now, because when stored these can be attacked by quantum computers later. Post-quantum cryptography algorithms such as Module-Lattice-Based Key Encapsulation Mechanisms (ML-KEM) [2] are designed to resist these attacks, fortifying the integrity of our digital infrastructure. A secured implementation of these algorithms is crucial to withstanding classical security attacks.

  Infineon's latest achievement demonstrates the company's commitment to providing future-proof security solutions. "With our innovations in post-quantum cryptography and active contribution to algorithm development, Infineon is an integral part in finding future-proof PQC solutions," said Thomas Rosteck, Division President Connected Secure Systems at Infineon. "There is no question that quantum computers will be a reality; Therefore, we need to push forward with the migration to post-quantum cryptography decisively. Being the first company to receive the Common Criteria EAL 6 certification for post-quantum security is a testament to our dedication in protecting critical infrastructure and helping maintain the security of our customers' data in a post-quantum world. This once again underpins Infineon's leadership in the security industry."

  "The threats posed by quantum computers are becoming more and more real and are within reach," said Claudia Plattner, President of the German Federal Office for Information Security (BSI). "The BSI consistently supports and demands the switch to post-quantum cryptography in order to make files and applications secure in the long term. The availability of quantum-safe IT products, which can also be found in numerous everyday applications, is therefore a real milestone!" 

  The international Common Criteria standard sets guidelines and criteria for the security of IT products and systems and is internationally recognized. By certifying Infineon's secured implementation of a PQC algorithm with Common Criteria EAL 6, the BSI underlines the importance of resistance against classic attacks, like fault attacks, as well as quantum computer attacks. The ML-KEM algorithm was implemented on a TEGRION™ security controller, Infineon's latest brand of 28 nm security controllers based on Infineon's revolutionary security architecture Integrity Guard 32. The Common Criteria scheme was developed in collaboration among various governments and is recognized by governments around the globe. The certification itself takes place through various national institutions. Infineon's TEGRION security controller has been evaluated and certified by the German BSI under the German Certification scheme.

  EAL6 is a highly advanced level of assurance, indicating that the product or system has undergone a comprehensive and rigorous evaluation to confirm its security claims. The certified security controller combines high-performance processing with advanced cryptographic capabilities, providing a robust foundation for post-quantum cryptography. With this certification, Infineon is setting a new standard for the industry, paving the way for widespread adoption of post-quantum cryptography and for a safer digital future. And with the PQC era approaching fast, Infineon will continue working on further and more advanced quantum-resistant solutions.

  [1] Bundesamt für Sicherheit in der Informationstechnik / Federal Office for Information Security

  [2] Module-Lattice-Based Key Encapsulation Mechanism (ML-KEM) is a type of post-quantum key encapsulation mechanism that combines the hardness of lattice problems with the algebraic structure of modules to provide secure key establishment and encapsulation.

• Infineon optimizes and diversifies its manufacturing footprint with new backend fab in Thailand (Apr 07, 2025)

  Bangkok, Thailand – 14 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint. After an official meeting with the Prime Minister of Thailand, Paetongtarn Shinawatra, at the Government House, Infineon's Chief Operations Officer Dr. Rutger Wijburg launched the construction of the new fab today.

  The first building is planned to be ready for operations at the beginning of 2026. Further ramp-up will be managed flexibly in line with market demand. For 2025, all expenditures of the new site are already included in the Capex projections of the company. The project is supported by the Thailand Board of Investment (BOI). The highly automated fab will play a crucial role in diversifying Infineon's manufacturing landscape as global decarbonization and climate protection efforts drive demand for power modules, e.g. in industrial applications and renewables.

  "As decarbonization and digitalization are strong structural growth drivers for the semiconductor industry, we are establishing a state-of-the-art backend fab in Thailand to meet future customer demand and strengthen supply chain resilience. This investment is a key step in our strategy to further diversify our manufacturing footprint and optimize it in terms of costs, while matching the expansion of our frontend capacities," said Rutger Wijburg, COO of Infineon. "Our new backend site is designed to operate with high efficiency, resilience and quality, ensuring that we can reliably deliver high-quality products to our customers."

  "The Thailand Board of Investment welcomes and supports the Infineon Technologies decision to invest in a new backend fab in Samut Prakan, Thailand. This strategic step underscores the importance of a close and reliable partnership between Infineon and the government of Thailand, and demonstrates the mutual confidence in Thailand's business environment and growth potential. The establishment of the National Semiconductor and Advanced Electronics Policy Committee in December 2024, along with Infineon's investment, will significantly enhance the regional semiconductor industry and ecosystem, positioning Thailand as a key player in the global semiconductor industry. We are committed to supporting the development of Thailand's electronics industry as well as the successful implementation of the expansion of Infineon's manufacturing site in the region," said Narit Therdsteerasukdi, the BOI's Secretary General.

  Infineon will support developing a robust semiconductor ecosystem in Thailand, centrally located in Southeast Asia, covering key components and materials in the supply chain. By enhancing partnerships with local businesses and institutions, the company will strengthen the semiconductor ecosystem and the development of a skilled work force. Through close collaboration with universities and local entrepreneurs, Infineon helps to grow a talent pool of highly skilled engineers with expertise in advanced semiconductors. A comprehensive training and education program to improve competencies in AI, digitalization and automation has been developed. The first group of Thai engineers successfully completed this training program at other Infineon sites. 

  As Infineon is committed to achieve climate neutrality by 2030, decarbonization efforts are an integral part of design and construction of the new facilities. Continuously reducing its own carbon footprint along the entire value chain is a strategic priority of the company. The new site will be equipped with solar modules, generating its own renewable energy. Moreover, Infineon will closely collaborate with local energy suppliers to ensure a reliable and green power supply.

  Products