The Flying Spot Scanner 310 + CHRocodile 2It is a high-performance optical 3D sensor designed for non-contact measurement of TTV, bow, warp, and surface topography in a single scan. It delivers nanometer-level height resolution and sub-micron lateral resolution — ideal for applications in semiconductor and advanced electronics manufacturing.
The system enables full-field measurements across wafer surfaces up to 12", ensuring fast, accurate, and repeatable results. Its robust design and integrated vibration compensation allow for reliable inline and offline use in production environments.
Optimized for transparent, reflective, and structured surfaces, the Flying Spot Scanner 310 combines high throughput with precision. It supports Industry 4.0 integration through standardized interfaces, ensuring easy automation and data connectivity.