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Shenzhen Therlicon Technology Co.,Ltd

深圳市,  Guangdong Province 
China
http://www.tlc-semi.com
  • Booth: B2101

Hello! Welcome to THERLICON

Overview

THERLICON has 25 years of experience in heat treatment technology research and development, focusing on vacuum and heat treatment equipment in the field of semi thermal engineering. We insist on customer-centricity, high-quality products, excellent services, and continuous innovation. We are committed to becoming a trustworthy Chinese brand in the field of semi thermal engineering.


  Products

  • TFV Series Formic Vacuum Reflow Oven
    Formic Vacuum Reflow Oven is mainly used in the new energy industry for the soldering of Si IGBT /SiC MOSFET power modules, which is characterized by high temperature, fast temperature rise, precise flow control, etc....

    • Used for solder pad or solder paste process, use hot plate contact heating, the soldering temperature can reach up to 420℃.
    • Precise gas flow control, used for flux-free soldering process of N2, N2+H2, N2+HCOOH mixed gas.
    • Independent soldering and cooling module, online three or four chambers structure, improve the production.
    • Precise and stable pressure within 1mbar, chamber pressure control independently, the void rate≤1%.
  • TRV Series Vacuum Reflow Oven
    TRV Series Vacuum Reflow Oven can realize the mass production of vacuum soldering, built-in vacuum module, can extract vacuum sections, and void rate can be reduced to below 1%....

    • Low void rate. the ultimatee vacuum can reach within 2mbar, and the maximum void rate of a single solder pad meets the requirement of <1%.
    • Accurate and flexible temperature control. the temperature of each heating zone is independently monitored and adjusted separately. Flexible implementation of various soldering processes.
    • Multi mode production process. Quickly switch between vacuum and normal modes to meet various process applications.
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