With the development of chip structure and advanced packaging technology, wafer-level testing is becoming more and more important. Compared with traditional finished product testing, wafer-level RF parametric testing puts forward higher requirements for testing solutions in terms of calibration, probes, test accuracy, and result generation.
Main Features:
- Support for single-site and dual-site measurements.
- Support for importing calibration files.
- Support for sampling testing of dies in wafers (sampling ratios: 1/2, 1/4, 1/8, etc.).
- Low yield rate alarm in software.
- Support for mapping function, outputting results including Mapping (txt), S-parameter files, DAT files, STDF files, and test log files, with the STDF files being parseable into CSV files.
- Open API, supporting data upload to MES (Manufacturing Execution System).