Booth L3115. Supplier of highspeed camera since year 2000.
Overview
Our highspeed cameras are used in wire-bonding, Die/SMT Pick and Place application. It is an essential equipment that record the very fast motion of the SEMICON production equipment and instantly playback for process and QC engineer to quickly understand the quality of the wire bonding process or for evaluating the movement and positioning of the Pick and Place nozzle head.
In the wire-bonding process, engineer wants to know how the wires are deformed and making lead bond and ball bond, whether the process is creating necking during bonding process. This kind of inspection and evaluation is possible with our high performance highspeed camera system.
In the Die or SMT pick and place process, the amount of pressure and acceleration in the nozzle head created during Pick and Place are recorded by the highspeed camera at camera recording speed of 2,000 fps or more, therefore, the risk of damaging or cracking of the ultra thin wafer die during the picking and placement process is minimised.
The high speed camera is essential for the tuning of wire bonder and Die Pick and Place for optimal performance. When the product at the end of the finish line is defective or has high failure rate, find out the cause with our highspeed camera system and solution. Please visit https://www.hitech.com.sg/product-category-semiconductor-harddisk for more information.
YUKI M series - 1280 x 1024 pixels @ 8,000 fps and up to 500,000 fps at reduced resolution
YUKI S series - 1920 x 1080 pixels @ 3,200 fps and up to 300,000 fps at reduced resolution
YUKI H1 series - 1280 x 1024 pixels @ 15,800 fps and up to 1.15 million fps at reduced resolution
Our highspeed cameras are also used in the analysis of Tape and Reel or carrier packaging process.
Call us at [email protected] for a free demonstration on our highspeed camera and solution.
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