TECHNIC

A Global Leader in:

  Specialty Chemicals

  Surface Finishing Equipment

  Engineered Powders

  Analytical Controls

Technic offers a full range of chemistry for advanced semiconductor packaging. Marketed under the name Elevate, Technic’s electrodeposition chemistries are well respected for innovation and high-quality in such applications as RDL, pillars, microbumps, and LED packaging. Technic also supplies several high-performance photoresist strippers for liquid and dryfilm resists, as well as a full range of metal etchants and cleaners marketed under the names, TechniStrip®, TechniEtch, and TechniClean.

• TechniStrip®: Liquid resist and laminated film strippers
• TechniEtch: Selective barrier, seed layer, stack etchants
• TechniClean: PER removers, PCMP Cleaning, ink remover, debonding, etc.

Technic offers a wide range of electroplating products for semiconductor applications, including: Cu, Ni, Sn, Au, Au/Sn, In, commercialized under the Elevate®

Elevate Gold 7990 NBV HT
Electrolytic sulfite gold process that produces pure, soft gold deposits. Operates at an acidic pH, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic.... More Info Less Info



Electrolytic sulfite gold process that produces pure, soft gold deposits. Operates at an acidic pH, making it compatible with almost all photoresists. Elevate Gold 7990 NBV HT produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage. Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.
Features
• Very stable electrolyte
• Low-stress deposit
• Smooth, bright deposit without the use of harmful metallic grain refiners
• Low deposit thickness variation across the wafer even with small and large features on the same die
• Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
• Extended bath life of 4 – 5 metal turnovers in most applications
• Currently in production around the world in high volume manufacturing
Benefits
Reduced cost of operation through:
• Extended bath life which significantly reduces the number of bath makeups per year
• Stable electrolyte eliminates scrap produced from bath plate-out
• Excellent coplanarity and step coverage resulting in less gold used per wafer
• High-speed plating increases wafer production capabilities
• Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible
• For use in plating tools from manual wet bench and R&D to fully automatic production lines
• One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry

TechniEtch TBR19
High-Performance Etchant TechniEtch TBR19 is a stabilized hydrogen peroxide based metal etchant that is extremely selective with a very low undercut value of < 0.2 microns.... More Info Less Info



TechniEtch TBR19 is an enabling, fluoride-free aqueous solution, designed to selectively dissolve titanium (Ti) and titanium alloy based (TiN, TiW) barriers for far back end of the line (BEOL) interconnect applications.  This high performing metal etchant can significantly reduce undercut.  Techni Etch TBR19 is compatible with most UBM, and copper pillar integration materials such as Cu, Al, Ni, Sn and alloys, glass, organic substrate, etc
Features
• Excellent selectivity
• Low undercut
• Improved etch uniformity
• Stable and consistent etch rate over the life of the bath
• Fluoride-free aqueous solution
• Compatible with most UBM and copper pillar integration materials
• Fully compatible with aluminum
• Tunable etch rate

Benefits
• High selectivity and low undercut provides high yields with fine pitch patterns
• Reduced cost of operation through extended bath life
• High process efficiency through stable chemistry and consistent etch rate
• Wide process operating window – 50% process overetch still results in minimal undercut

TechniStrip® NF52
TechniStrip® NF52 is high dissolution, high metal compatibility and NMP-free resist stripper formulated to provide powerful stripping performance on difficult to remove photoresist and is the product of choice for many leading semiconductor manufacturers... More Info Less Info



TechniStrip® NF52 provides full dissolution of most photoresist without the use of harmful products such as NMP and Hydroxylamine. NF52 successfully performs without any negative impact to the copper surface, preserving critical fine features that would otherwise be negatively impacted by photoresist strippers that can etch into fine surface details.
TechniStrip® NF52 is effective and compatible with numerous substrates.  It has been documented to perform with an extended bath life that is typically 2–3 times greater than standard photoresist strippers, resulting in a significant savings in operating costs.
Features
• Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
• Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
• High stripping rate of > 10 µm/minute
• Long bath life
• Proven performance on both batch (spray and immersion) and single-wafer toolsets
Benefits
• Reduced cost of operation achieved through a highly efficient process and longer bath life
• Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
• High metal compatibility provides wider processing window and ease of operation
• CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators

Real Time Analyzer (RTA) 3D
Technic’s RTA systems have set the standard for robust analytical performance in plating. These highly reliable tools offer trouble-free, accurate analysis of your electroplating solutions by monitoring and controlling levels of chemical constituents.... More Info Less Info



Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The Technic RTA is the only commercially available automatic instrument that utilizes a combination of modern electrochemical techniques (Cyclic Voltammetry including) with state-of-the-art statistical (chemometric) approach.
Benefits
• Early fault detection capability
• Virtually consumable-free
• No need for reagents or chemical operations (no waste generated)
• Small footprint
• Very low maintenance
• Great reproducibility and accuracy
• High reliability
• Low cost of operation

Features
• On-line in-tank method
• State-of-the-art electronic components
• Innovative electrochemical techniques
• Intuitive graphical user interface
• Full analysis of undiluted bath in 15-30 min. (all components)
• Automatic temperature correction capabilities
• Open software architecture allowing for customization and integration
• Design based on field experience and customer feedback


Semcon® 2500

The Semcon 2500 plating tool is fully compatible with any commercially available electroless, immersion, and ancillary chemistries as well as Technic’s exclusive line of Elevate brand chemistry for ENIG and ENEPIG.... More Info Less Info





The Semcon 2500 is a tri-axis, fully automatic, cleanroom-rated plating tool for deposition of electroless nickel, electroless palladium, immersion gold, immersion palladium, and immersion silver chemistries. The system processes wafers from 50 – 200 mm using custom or commercially available wafer cassettes.

The Semcon 2500 offers ease of operation with multiple programming options, easy changeovers, with convenient maintenance access all in a space-saving and highly reliable tool.

Features
• Tri-axis cleanroom grade automatic hoist with dynamic scheduling software
• Rotomolded tanks designed with rounded corners for reduced plateup
• Independently adjustable flow controls in processing cells and reservoirs
• Multi-recipe management system with data logging for traceability
• Chemical dosing and filling system with programmable mixing sequences
• Choice of custom or industry-standard wafer cassettes


Benefits
• Turnkey process available including analytical controllers, chemical dosing, and Technic Elevate electroless and immersion chemistries.
• Fully compatible with all Technic Elevate chemistries which reduce time and costs by being able to quickly establish optimum process parameters and efficient control systems.
• Space-saving configurations – process cells configured in two rows vs. single row which results in a slightly deeper but much shorter tool. Fully maximizing valuable cleanroom floor space.
• Extended bath life – rotomolded rounded corner tank design extends bath life by preventing excess plate-out on sharp corners and irregular surfaces.
• Wafer size processing flexibility (50 – 200 mm)
• Reliability and value – designed, fabricated, and installed by an experienced industry leader in electroless and immersion production plating.



TechniClean CA25

TechniClean™ CA25 is an acidic semi-aqueous blend design to address post etch residues (PER) removal for all interconnects and technology nodes.... More Info Less Info





The inherent formulation ingredient proprieties have been proven utterly efficient at removing quickly and selectively organo-metal oxides from the following materials: Al, Cu, Ti, TiN, W and Ni.


TechniClean CA25 constituents were finely tuned to attain the most advantageous physico-chemical properties balance in terms of surface wetting, reducing potential, chelating capacity and residue solubility, permitting to accomplish complete PER dissolution at low temperature and short processing time for various electronic vehicles (lines, vias, PAD, Cap MIMS, etc).


TechniClean CA25 main features: unmatched PER cleaning versatility, high efficiency at low temperature, no intermediary rinse, low environmental impact (fluoride, amine, hydroxylamine and catechol free), cost effectiveness.