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Test Research, Inc. (TRI)

Penang,  Malaysia
http://www.tri.com.tw
  • Booth: L2632

SEMI & Advanced Packaging Industry Inspection

Overview

Founded in 1989, Test Research, Inc. (TRI) is the World's leading brand in Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. Test Research, Inc. offers the most robust product portfolio in the industry for automatic test and inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D AXI systems to Manufacturing Defect Analyzers (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a wide range of manufacturing test and inspection requirements.

TRI provides Test and Inspection equipment for multiple electronics manufacturing, from Automotive, Medical, and Consumer electronics to Advanced Packaging & Semiconductor manufacturing. TRI's inspection solutions offer Smart Programming, Multiple 3D Technologies, Metrology measurements, and AI-Powered Algorithms.

TRI SEMI Inspection Functions
Die Bonding
Missing, Orientation, Rotation, Shift, Tilted, Chipping, Crack, Scratch, 
Bond line thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height
Wire Bonding
Broken, Short, Sweep/Sink, Missing, Sway, Collapse, Loop Height
Sagged Wire, Cross Wire Gap, Wire Tracing, Ball Bond Diameter
Ball Placement, Stitch Width, Stitch Coverage over Ball
Ball-off Pad, Ball touch Pad Distance, Clubbed Ball, Ball Thickness
Lifted Ball, Low Landing, Bond on Contamination
Bonding Area/Pad
Copper Protrusion, Crack, Chipping, Exposed Copper, Exposed Nickel, 
Target Material, Scratches or Brush Marks, Oxidation
Molding / Underfill Materials 
(EMC, CUF, NCP, NCF, MUF)
Area coverage, Dimensions, Surface, Void, Damage, Crack, Scratches, 
Delamination, Contamination, Surface particles
Patterned Wafer Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling,
Probe Mark Defect, CD Measurement
Bump Wafer 2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material, CD Measurement
Wafer Frame Chipping, Crack, Scratch, Particle, Contamination, CD Measurement, Saw 3D metrology
TSV Measurement TSV depth, trench depth, oxide, nitride, PR, and PI film thickness

  Press Releases

  • [March 6, 2025 – Singapore] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at the SANDS Expo and Convention Centre in Singapore from May 20 - 22, 2025. Visit booth #L2632 to learn about AI-powered AOI solutions for Advanced WLP/PLP and SEMI Back-End Package processes.

    TRI will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a High-resolution 2.5 μm 25MP camera and the TSV Metrology Module. The TR7950Q SII can perform Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more. The TR7950Q SII can measure TSV at ultra-high speeds, measuring sensing TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.

    Patterned Wafer

    TSV Metrology

    Wafer Frame

    Wafer Bumping

    Wire/Die

    Additionally, TRI will showcase the TR7007Q SII-S, the high-accuracy 3D SEMI SPI for precise solder measurements, supporting applications such as Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection. The lineup will also feature an X-ray Inspection Demo Station.

    Join us at SEMICON SEA 2025 (booth #L2632) to discover TRI's cutting-edge SEMI inspection and metrology solutions!

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    About TRI

    TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Optical Inspection to Board Testing, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +604 6461171.

  Products

  • Wafer Inspection and Metrology - TR7950Q SII
    The TR7950Q SII can perform Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more....

    • TR7950Q SII - Wafer Inspection and Metrology Platform

    Features:

    • High Resolution 1.2 μm Wafer Macroscopic 2D / 3D Inspection 
    • Precise Micro Measurements with Metrology Capabilities
    • Ultra High-Speed TSV Metrology
    • Inspection for: Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV). 
    • TSV measurement capabilities: TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.
    • Cleanroom: Class 100 - ISO 5 Clean Room
  • 3D SEMI SPI - TR7007Q SII-S
    High-accuracy 3D SEMI SPI for precise solder measurements, supporting applications such as Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection....

    • Features: 

    • 3.5 μm High-Resolution 3D SEMI Back-end, Mini-LED and 008004 solder inspection
    • Advanced Wide wide-spectrum light for Enhanced Contrast and Detection Rate
    • Improved Accuracy and Stability for Precise Solder Measurements
    • High Precision Inspection for Multiple Applications
    • Industry 4.0 Ready Platform
    • Ensures clean operation with HEPA Filter*

    For more information visit: https://www.tri.com.tw/en/product/product_detail-70-2-1799.html

Categories

203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Package Inspection; Lead Scanners
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; Lexes Systems
    • 602 Manufacturing Software
  • Yield Management; Process Control Software
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