This thermal processing platform is capable of both highly difficult deposition and high productivity on next-generation devices that have increasingly precise and minute structures. Thanks to greatly increasing the surface area that needs for film forming and adopting new technology that achieves highly difficult deposition on 3D stacked devices with increasingly complex structures, the platform can provide high-quality processing.
Features
- High performance wafer reactor
- Unique design that reduces loading effect and improves uniformity of film thickness
- Shortens total deposition time dramatically with improved reaction gas purging efficiency
- High-performance gas supply and exhaust system
- Low particle & high speed wafer transfer automation
- High productivity, small footprint
- Realizing of high-capacity and high-speed by using a new controller and control method
- Optional health check function that collects equipment data and monitors equipment operation