CXsemi Company Limited

Product Features

-Multi-functional measurement including bow, warp, TTV, LTV, SFQR and stress.

-High measurement speed: bow, warp, and stress can be completed within 10 seconds, and TTV within 20 seconds.

-Global coverage, encompassing the entire wafer surface.

-Compatible with Si, SiC, GaN, and glass.

-Suitable for 2” to 12” wafers or square-shaped materials.

Especially suitable for advanced packaging or wafer leveling packaging process.

This system supports a variety of substrates, including silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), and even glass wafers, making it highly versatile for different semiconductor materials.

Additionally, the system includes a **3D function for step height analysis**, enabling accurate assessments of multi-layer films or wafers. This feature is particularly useful when working with complex structures, as it allows us to obtain precise measurements regardless of the wafer’s height variations.

 The system monitors for wafer breakage or anomalies during semiconductor processes. Upon detecting issues, it can immediately halt robotic operations to prevent further damage.

- **AI Detection for Transmission Abnormalities**: Through real-time AI-based monitoring of wafer transmission areas, this feature identifies irregularities swiftly, preventing costly interruptions in production.

Features

✓ Bright field / Dark field / Polarizing / DIC

✓ Objective 5x , 10x , 20x , 50x , 100x

✓ Electronic nosepiece

✓ 3-layer mechanical stage with low position coaxial adjustment

✓ C-mount adapter 0.5x , 0.65x , 1x Polarizing kit ; interference filters ; high precision micrometer ; DIC