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Osiris International GmbH

Singen Htwl.,  Germany
http://www.osiris-nano.com
  • Booth: B1718

We have the right solution!

Overview

Osiris International is a technology and equipment manufacturer to the Semiconductor and MEMS industry and provides single wafer processing systems for a wide range of optimized front- and back-end solutions.

The primary application areas for the surface treatment are photoresist spin/spray coating, developing, metal lift-off, etching, cleaning, and tempering of wafers and substrates. Our portfolio also includes temporary bonding and debonding systems and also dispensing system for low and high viscosity PR.

We offer compact systems, individually configurable, from fully automatic to semi-automatic for countless process options and a wide range of throughput and flexibility requirements. Our equipment are efficiently designed for processing semiconductor materials with special coatings. Whether extremely thin round wafers or large square substrates.

They are efficiently designed for processing semiconductor materials with special coatings. Whether extremely thin round wafers or large square substrates.
- We have the right solution!

  Products

  • AUTOMATIC SINGLE WAFER CLUSTER SYSTEMS
    PRIMING, RESIST COATING, DEVELOPING, TEMPERATURE MODULES...

    • Automated or semi-automated systems with multi process chambers.
    VARIXX 120X

    BENEFITS
    ÷ Flexible configuration of process modules
    ÷ Application: priming, resist coating, developing and baking/cooling
    ÷ Substrates sizes up to Ø300mm or up to 230 x 230 mm
    ÷ Different types of nozzles
    ÷ Inline or centralized substrate handling
    ÷ Wafer flipper
    ÷ Pre-Alignment or AOF
    ÷ I/O-Station over cassette or foup loadport
    ÷ Handling for thin, standard or bonded wafer (Si, glass & others)
    ÷ Standard or customized chuck design
     

  • SEMI & AUTOMATIC SINGLE WAFER WET PROCESS SYSTEMS
    CLEANING, ETCHING OR DEVELOPING...

    • Automated or semi-automated wet processing systems.
    CHEMIXX 120X

    BENEFITS
    ÷ Automated modules with one or multi process chambers
    ÷ Application: cleaning, etching, developing and drying
    ÷ Substrates sizes up to Ø300mm or up to 230 x 230 mm
    ÷ Up to two electric media arms
    ÷ Different types of nozzles
    ÷ Inline or centralized substrate handling
    ÷ Wafer flipper
    ÷ Pre-Alignment or AOF
    ÷ I/O-Station over cassette or FOUP loadport
    ÷ Vacuum or low contact chucks

Categories

100 Device Manufacturers
  • Micro Electro Mechanical Systems (MEMS); Micro Machines
    • 200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Die Bonding; Attach Equipment
  • Dispensing Systems
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vacuum drying & out gassing Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry etching
  • Wafer Level Bonders
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
  • Transfer Systems for Wafer; Reticles or FPD's
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 401 Sub-systems
  • Pumps, for Fluids
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems
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