DELO Industrial Adhesives (Singapore) Pte. Ltd.

DELO develops tailored functional materials optimized for different applications such as die attach, underfill, cap bonding and encapsulation. These materials are used to bond individual components, protect components, reinforce solder joints (e.g., via processes like Edge Bond or Cornerfill), and to produce precise 3D structures. They are also used in sensor applications such as MEMS sensors. DELO materials are optimally suited for fully automated series production. They can be applied by screen and stencil printing, as well as jetting.

DELO DUALBOND helps drive innovation in autonomous driving while meeting the stringent requirements of the semicon and automotive industries. Unlike adhesives previously available on the market, this adhesive is flexible with a Young's modulus of less than 5 MPa at room temperature. Due to these flexible properties, starting from a temperature as low as -50°C, it can compensate for pressure changes that occur, such as those caused by changes in temperature, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected. DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. 

With this adhesive, filter glasses can be bonded directly to the die. It can be dispensed in narrow, high bondlines, can compensate for temperature-dependent pressure changes and meets the requirements of typical automotive standards. The adhesive has a relatively high Young's modulus of 2,350 MPa and significantly higher adhesion values compared to previous products. Due to the glass transition temperature (Tg) of over +130 °C, the adhesive exhibits consistent mechanical behavior even at high temperatures, for example during the molding process. Curing takes place in two successive process steps: with light and heat. Due to the fast-curing reaction, the matrix in the adhesive is quickly formed, which helps to ensure the reliable sealing of the image sensor package. Both the dual curing process and the comparatively low curing temperature help to ensure tight sealing of the sensor package.

The growing popularity of miniaturization in microelectronics manufacturing and SMT poses a challenge on which micro dam dispensing opens up new design possibilities. With DELO DUALBOND EG4797, you can achieve line widths smaller than 100 µm with aspect ratios greater than 5 using the dispensing process developed jointly by NSW Automation and DELO. What makes this process unique is the one-step UV light curing after dam structure completion. If required, heat curing is also possible but not mandatory. Micro dam can be used as a flow stop for underfills or as a light barrier in optical sensors, just to name a few examples.

Replacing the successful DELOLUX 80 LED curing lamp, this new lamp features a higher peak intensity of up to 22.5 W/cm² as well as increased homogeneity in its intensity distribution, resulting in faster fixation and a more consistent final bond. Available in wavelengths of 365, 400 and 460 nm, DELOLUX 30 can be had in one of two configurations: either as an all-in-one package which includes a control unit and integrated water-cooling capability, or as an individual lamp head that systems integrators can supplement with their own preferred equipment. The cylindrical lamp head measures at 80 mm tall with a diameter of 30 mm, connecting with a highly flexible 450 mm-long flat-ribbon cable, allowing for seamless integration.

DELO-DOT PN5 is a pneumatic jet valve that can reproduce dispensing results at a continuous frequency of up to 300 Hz, even on difficult media. It allows for contactless application, preventing collisions between the dispensing valve and the component. Even high-viscosity materials can be dispensed accurately, precisely, and reliably. The valve offers interchangeable nozzles with different diameters, as well as a flexible adjustable plunger stroke. This ensures that the application is reproducible using drop sizes of varying nanoliters. With its dimensions of 68 x 28 x 99.5 (W x D x H), DELO-DOT PN5 can be integrated into process systems to save space. The jet valve’s cartridge retainer, which can be positioned in 90° increments, allows media to be fed from all four sides of the device. This further simplifies integration into production systems.

If it is the case that DELO-DOT PN5 is too large to integrate, or that the lowest possible viscosity it can dispense is still too high for certain applications, DELO has developed an alternative solution in DELO-DOT PN5 LV. With ‘LV’ standing for ‘low viscosity,’ its key difference from its bigger brother is its ability to dispense low-to-medium-viscosity materials, ensuring consistent throughput. At 68 x 90 x 19 mm and weighing just 240 grams, it is both modular and extremely compact and lightweight, requiring little installation space in assembly lines. The nozzle and plunger are both removable without the need for tools thanks to its bayonet lock, which makes it easy to integrate disassemble for cleaning or parts replacement. And unlike needle dispensers, PN5 LV does not need Z-axis movement to contact the substrate to create a quality bondline with high reproducibility and no dripping, enabling continuous dispensing frequencies as high as 250 Hz and dispensing on complex geometries.