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Minoru Co., LTD.

Ota,,  Tokyo 
Japan
http://www.minoru-japan.co.jp/en
  • Booth: B2543

Overview

Minoru Co., Ltd. is a leading Japanese manufacturer specializing in the development and production of high-performance Thermal Interface Materials (TIMs) and Electromagnetic Interference (EMI) Absorbers. With a steadfast commitment to innovation, precision, and reliability, Minoru serves the demanding needs of industries where quality and durability are paramount, including the automotiveelectronicstelecommunications, and other high-reliability markets.

For decades, Minoru has built a reputation for delivering cutting-edge materials that ensure superior thermal management and electromagnetic shielding performance. By combining state-of-the-art research, advanced production techniques, and strict quality assurance, the company continues to provide solutions that meet the evolving demands of global industries.


Core Products

  1. Thermal Interface Materials (TIMs):
    • Designed to enhance heat dissipation in high-performance systems.
    • Applications include automotive electronics, power modules, and consumer electronics.
    • Features include high thermal conductivity, reliability under extreme conditions, and durability over extended lifetimes.
  2. Electromagnetic Interference (EMI) Absorbers:
    • Used to minimize electromagnetic noise and interference in sensitive systems.
    • Applications span automotive radar systems, 5G communication devices, and IoT-enabled products.
    • Renowned for high absorption efficiency, broad frequency range coverage, and ease of integration.

Markets Served

Minoru Co., Ltd. primarily focuses on industries where reliability and performance are critical to success. The company's materials are trusted by leading global brands in markets such as:

  • Automotive: Ensuring stable operation in advanced driver-assistance systems (ADAS), electric vehicle (EV) components, and autonomous driving technologies.
  • Electronics: Providing solutions for thermal and EMI management in consumer and industrial electronic devices.
  • Telecommunications: Supporting next-generation communication devices, including 5G infrastructure and high-frequency electronics.
  • Industrial Equipment: Enhancing performance and durability in high-stress applications.


  Press Releases

  • [Tokyo, Japan – January 21, 2025] – Minoru Co., Ltd., a leading Japanese manufacturer specializing in high-performance thermal interface materials (TIMs) and electromagnetic interference (EMI) absorbers, is pleased to announce its participation in SEMICON Southeast Asia 2025, the region’s premier platform for the semiconductor and microelectronics industry. The event will take place from May 20-22, 2025, at the Sands Expo and Convention Center, Singapore.

    At SEMICON Southeast Asia 2025, Minoru Co., Ltd. will showcase its latest innovations designed to meet the challenges of the rapidly evolving semiconductor and electronics industries. With a focus on advanced thermal management and EMI suppression technologies, the company’s solutions are integral to improving the performance, efficiency, and reliability of next-generation electronic devices.

    Highlights at Minoru Co., Ltd.’s Booth

    • Thermal Interface Materials (TIMs): Minoru’s TIMs are engineered for superior thermal conductivity and reliability, ensuring exceptional heat dissipation in compact, high-performance electronic systems.
    • EMI Absorbers: Designed to suppress electromagnetic interference, Minoru’s EMI absorbers improve signal integrity and system performance, addressing the increasing demand for high-frequency, high-speed applications.
    • Tailored Solutions: Minoru Co., Ltd. offers customizable materials and solutions to meet the unique needs of its global clients, supported by robust R&D capabilities and decades of manufacturing expertise.

    “We are thrilled to bring our cutting-edge technologies to SEMICON Southeast Asia 2025 and connect with key players in the region’s booming semiconductor industry,” said Kumazawa, Director at Minoru Co., Ltd. “Our advanced thermal interface materials and EMI absorbers address critical challenges in electronics design, helping our customers achieve unparalleled performance and efficiency in their products.”

    Minoru Co., Ltd.’s booth will feature live demonstrations of its latest TIMs and EMI suppression solutions, providing attendees with hands-on opportunities to explore their benefits. Technical experts from the company will also be on-site to discuss customized solutions and insights into emerging industry trends.

    Visit Minoru Co., Ltd. at Booth #B2543 at SEMICON Southeast Asia 2025 to discover how its innovative materials are driving progress in the semiconductor industry.

    For more information about Minoru Co., Ltd., please visit https://www.minoru-japan.co.jp/en/ or contact:
    Minoru Co., Ltd.
    [email protected]


  Products

  • Low VOC Thermal Gapfiller
    TGF series is a single-component, low-VOC Gapfiller...

  • TGF series is a single-component, low-VOC thermal interface material (TIM) offering exceptional thermal performance with low thermal impedance, high flowability, and excellent gap-filling capabilities. This top-tier material is designed to meet the demands of applications requiring high performance and reliability in TIM solutions. Its superior flow characteristics enable seamless conformity to uneven surfaces and gaps, ensuring optimal thermal management.

  • TGA Acrylic Thermal Interface Materials(TIM)
    The TGA series Acrylic TIM...

  • The TGA series Thermally Conductive Acrylic Interface Pads are engineered to facilitate efficient heat transfer between heat-generating components and cooling solutions such as heat sinks, heat spreaders, or other thermal management devices. These pads are composed of a highly conformable, slightly tacky acrylic elastomer sheet infused with thermally conductive ceramic particles, offering enhanced thermal performance and reliability.
  • AHxxW series RF Absorbing TIM
    AHxxW series is a polymer-based material engineered with exceptional thermal conductivity and wave-absorbing...

  • AHxxW series is a polymer-based material engineered with exceptional thermal conductivity and wave-absorbing properties, achieved through the integration of thermally conductive and wave-absorbing powders. These materials effectively convert electromagnetic wave energy into heat, minimizing interference from electromagnetic clutter on equipment while efficiently dissipating heat for optimal performance.

  • Thermally Conductive Interface Film 5701
    Thermally Conductive Interface Film 5701...

  • MINORU® 5701 is specifically engineered for excellent convertibility, ease of handling, and reworkability, achieved through the integration of an ultra-thin polyimide carrier. Its soft acrylic polymer formulation ensures superior wet-out and exceptional conformability to a wide range of surfaces, making it ideal for diverse applications.

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