Mainly used for semiconductor (silicon, silicon carbide, etc.), universal semiconductor (gallium nitride, silicon nitride, aluminum nitride, etc.), optics and 3C industries of hard and brittle materials single-sided high-precision grinding and polishing. The equipment meets the requirements of high flatness and high parallelism of products, and can be customized according to customer needs, and provide a set of equipment, process, accessories and professional services as one of the solutions.