In the field of semiconductor packaging molds, our products stand out with their exceptional precision and quality. The precision of our products can reach ±0.001mm, and the surface roughness can be as low as Ra0.02μm, which can meet the stringent requirements for high precision in semiconductor packaging and provide a solid guarantee for the reliable packaging of chips.
In terms of materials, we carefully select imported high-quality steel. This kind of steel has many excellent properties such as high hardness, excellent wear resistance, outstanding high-temperature resistance, and strong corrosion resistance. This not only significantly extends the service life of the molds but also ensures that the molds can still maintain stable performance during long-term and high-intensity production processes.
In terms of compatibility, the molds can be widely applied to various mainstream semiconductor packaging forms such as QFN, BGA, TO, and SC70, flexibly meeting the diverse needs of different customers and effectively improving production efficiency and product adaptability.
Quality control is of utmost importance to us. From the procurement of raw materials to the delivery of finished products, the entire production process of our products strictly adheres to the standard quality management system. After each process is completed, a meticulous inspection will be carried out to ensure that each mold meets the highest quality standards, providing customers with products they can trust.
In addition, we attach great importance to the customer's usage experience. If you find any quality problems during the usage process, you can immediately feedback to us. We will respond promptly and take full responsibility, providing you with comprehensive after-sales support.