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Shenzhen Cronus Technology Co., Ltd.

Shenzhen,  Guangdong 
China
https://xyz.factoryun.com/
  • Booth: L3205

Cronus Welcome to our booth：L3205

Overview

The main business of Shenzhen Cronus Technology Co., Ltd. is nano and micron level linear motor motion stages, semiconductor ceramic components, marble components, etc.We are an important supplier of manufacturing equipment and core components for semiconductor and IC industries. Our products are widely used in the precision production equipment for semiconductor, integrated circuits, panels, lithium batteries, solar photovoltaic and many other industries.
Cronus was founded in February 2015, headquartered in Guangming, Shenzhen, with wholly-owned subsidiaries Anhui Cronus Technology Co., Ltd., Shandong Cronus Material Micro-Grinding Technology Co., Ltd., Shenzhen Kunpeng High-End Equipment Research  Institute, Korea Y&G and Dalian branch office. Total Area: 16000 m²; Total Employees: 230. The senior level R&D and management team all came from famous international enterprises and research institutes, such as INNO 6, DCT, RICOH, OLYMPUS, Midea, Han's Laser, FOXCONN, and Shenyang Instrumentation Research Institute. We have high capabilities in R&D of software and hardware system, and strong ability of business transformation from research. We have been providing high-quality products and services to clients for years.

  Press Releases

  • Exhibit Highlights:   
    Cronus presents three innovative matrices at this dual exhibition:  

    1.Front-End Metrology Solutions:  
       · Mercury Motion Platform (±2 nm position stability)  
       · Uranus Motion Platform (40 ms settling time)  
       · Air-Bearing Rotary Table (25 nm runout error)  
       · Air-Bearing Motion Platform (±35 nm accuracy, ±5 nm jitter)  
    2.Advanced Packaging Solutions:  
       · Jupiter Motion Platform (±200 nm placement accuracy)  
       · Uranus Motion Platform (40 ms settling time)  
    3.Precision Machining Solutions:  
       · Air-Bearing Spindle (25 nm accuracy) 
      
    Technical Highlights:
    ·Jupiter Motion Platform: Revolutionizes traditional packaging processes with 2 m/s rapid response and ±200 nm placement accuracy.  
    ·Mercury Motion Platform: Sets a new benchmark for front-end metrology with ±2 nm stability and 1.25 m/s dynamic performance.  
    ·Air-Bearing Spindle: A milestone in precision machining with 20,000 rpm water-cooled direct drive and <100 nm radial error.

  Products

  • Air-Bearing Motion Stage
    Air-Bearing Motion Stage is a precision motion control system composed of
    air-bearing guideways and linear motors. It is primarily used in fields such as semiconductor manufacturing, precision machining, and precision assembly....

    • The air-bearing motion stage is an air-bearing system capable of displacement motion in the XYZ directions and is suited for nanometer-level step-and-scan motion. In wafer process control applications, it can be used for critical dimension and thin-film metrology, wafer dicing, wafer laser thermal annealing, as well as back-end lithography (mask aligners) and certain wafer-cutting applications. The platform features the following characteristics:  
    - Flatness of motion provided by air-bearing guideways  
    - Z-axis integration: Stroke for load/unload adjustment  
    - Built-in gravity compensator in the Z direction  
    - Yaw correction can be achieved by slightly adjusting the Y1 and Y2 motors  
    - Equipped with a high-performance vibration isolation system
  • MERCURY series Nano Level Detection Platform
    MERCURY is a precision motion control platform designed
    for semiconductor manufacturing equipment. It is primarily used in wafer production for critical dimension metrology, overlay metrology, and thin-film measurement....

    • Product Features:  
    1. Total Stroke: Up to 475 mm x 410 mm.  
    2. Included Options and Features: Particle suction rails, custom signals, pneumatic lines, and more.  
    3. Combination Module: Integrates rotation, wafer surface focusing, and plane deflection correction.  
    4. Built-in Vacuum Supply: At chuck level.  
    5. Short Move and Settle Times.  

    Product Advantages:  
    - Acceleration has been doubled to reach 20 m/s², with a maximum velocity of up to 1.25 m/s.  
    - Position accuracy of ±1 µm, paired with excellent bidirectional repeatability and high dynamics, supports application development across all technology and industry fields.

  • URANUS series Nano Level Detection Platform
    URANUS is a precision motion control platform designed
    for semiconductor manufacturing equipment. It is primarily used in wafer production for critical dimension metrology, overlay metrology, thin-film measurement, and flip-chip packaging....

    • Product Features: 
    - Compact footprint  
    - Nanometer-level position stability  
    - High dynamics  
    - Excellent bidirectional repeatability and position stability  

    Product Advantages: 
    - Combines high-performance ironcore motors, mechanical bearings, and high-end optical encoders.  
    - Designed to simplify the application of semiconductor production equipment manufacturing, incorporating the latest motion control concepts, a perfectly compact structural design, and significant improvements in mechanical structure and assembly to enhance the overall dynamic performance of the stage.  
    - Increases capacity without compromising equipment repeatability and accuracy, with an acceleration of 25 m/s² and a maximum speed of 1.2 m/s, while boosting payload and reducing equipment duty cycle.

  • JUPITERseries Nano Level Detection Platform
    JUPITER is a precision motion control platform designed for advanced semiconductor packaging manufacturing equipment. It is primarily used in die attachment (flip-chip packaging, fan-out packaging, hybrid bonding, 2.5D/3D packaging)....

    • Two Standard Variants Available: 
    - Variant 1: For Wafer Level Packages (WLP) 410 x 445 x 30 mm.  
    - Variant 2: For Panel Level Packages (PLP) 750 x 800 x 30 mm.  

    Product Advantages:  
    The platform offers multiple control features, including: zero settling time, non-linear control,  full synchronization of all axes with nanosecond jitter.  

    Product Features:
    1. ±350 nm local placement accuracy (moves with local alignment) at 10 kUPH throughput.  
    2. ±200 nm local placement accuracy (moves with local alignment) at 2 kUPH throughput.  
    3. ±1 µm global placement accuracy (blind moves).  
    4. Thermal transient of less than 10 minutes (from cold start to hot working state).  
    5. Up to 10 kUPH throughput for typical flip-chip die bonding applications.  
    6. Up to 2 kUPH throughput for hybrid bonding applications.  
    7. Up to 180 kUPH throughput for µ-LED bonding.  
    8. Acceleration of up to 4 g in X, 6 g in Y, and 7.5 g in Z.  
    9. Speed of up to 2 m/s in X and Y, and 1 m/s in Z. 

Categories

401 Sub-systems
  • Motion control systems; Servo control systems & Components
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