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Beijing CGB Technology Co., Ltd

Beiing,  Building 30 
China
http://www.cgbtek.com
  • Booth: B2432

Welcome to CGB booth!Join us and explore the potential!

Overview

Beijing CGB Technology Co., Ltd., was established in 2008, mainly specializes in R&D, production, sales and service of professional equipment used in semiconductors, pan-semiconductors and new materials. 
The application areas of the product include: integrated circuit manufacturing(IC),micro-electro-mechanical systems (MEMS), Silicon (Si)material, compound semiconductors, Optical Communication Devices, Power Devices, LED, Photovoltaic, flat panel displays, scientific research equipment, etc. 

  Press Releases

  • As a domestic manufacturer with long-term experience in semiconductor wet process equipment, CGB has always conducted all-round and full-process quality control in strict accordance with international quality management system standards, while focusing on continuous improvement and innovation.In the future, we will continue to improve our independent innovation capabilities and core competitiveness, and provide customers with more perfect technical services and professional customized solutions.

  Products

  • Fully Automatic Wet Cleaning Equipment
    The fully automatic trough cleaning equipment CGB-WB series owns multiple independent intellectual property rights and can be applied to RCA cleaning process The equipment adopts modular design and is easy to maintain....

    • This machine is an automatic control system controlled by lPC industrial computer and PLC, Through the control of RCA cleaning process, the matching application of super-mega-acoustic wave and the transfer of multiple manipulator systems, the function of “dry in and dry out”is realized for water cleaning, which reduces the interference of human factors on the cleaning process and meets the target requirements of wafer surface particle density and surface metal residue.
  • Fully Automatic Wafer Brushing Equipment
    The fully-automatic wafer brushing machine is mainly used for cleaning of 6" and 8" substrates and epitaxial wafers to remove residual physical particles on the wafer....

    • The equipment is mainly composed of (soaking) loading module, flip module, Brushing chamber, unloading module, laterally movable dual-arm robot module, liquid supply and discharge system, exhaust system and central control system. Brushing chamber has the functions of brushing, high-pressure two-fluid cleaning, nitrogen drying and centrifugal drying to reduce manual interference during the cleaning, ensure wafer-to-wafer uniformity and meet the requirements of wafer surface granularity.
  • Auto Wafer Chamfering Machine
    It has 2 processing axis, which can be controlled independently, or 1 axis can be processed separately. Compared with single-axis equipment, two-axis equipment can increase processing efficiency by 70%....

    • High accuracy of center alignment.The centering of the wafer is carried out on a self-designed transfer robotic arm, resulting in a significant improve-ment in cutting accuracy, with a machining precision of ± 30µm.
    Longer lifetime consumable materials.It can reduce the degree of grinding wheel wear, improve the service life of the grind-ing wheel, and minimize the length of downtime for replacing the grinding wheel.
    High yield output.Compared with single axis equipment, dual axis equipment can increase processing efficiency by 20%.
  • Marangoni Drier
    Marangoni dryer is mainly suitable for the drying of silicon carbide, polysilicon, silicon-based wafers, suitable for (4 "6" 8 "12") wafer, to meet different needs....

    • Marangoni drying is a drying technique based on the Marangoni effect. After entering the drying tank, the wafer overflows in the drying tank. The cavity is filled with IPA gas carried by nitrogen, forming an IPA gas environment on the water surface. As the slow drainage slowly separates the wafer from the water surface, since the surface tension of the IPA is much smaller than that of the water, it creates a surface tension gradient on the surface of the slope flow, creating Marangoni convection, and the water is “sucked back” to the surface to achieve the drying method. In addition, the device is equipped with an up and down conveying mechanism. During the drying process, cassette is separated from wafer in the processing tank to realize the cassette less process and prevent the poor drying of the contact part between cassette and wafer.
  • CDS Liquid Supply System
    CDS Liquid Supply System is central supply system for high purity chemicals,high purity chemical dilution and supply system ,central supply system for organic solvents and chip grinding fluid preparation and supply system....

    • The skeleton is CS+FC, the shell is PVC, and the liquid circuit is all made of high-purity PFA imported material.
    Dual pump configuration, automatic switching, ensuring continuous system power.
    The system is equipped with a gas-liquid separation device to effectively remove bubbles before and after emptying the bucket.
    Equipped with a damper that matches the pump, effectively suppressing pressure fluctuations.
    According to the different chemical media, filters that meet the flow requirements can be equipped, and detailed parameters can be selected accordingly.
    Digital monitoring of system supply pressure.
    PLC&HMI programmable control and human-machine interface, efficient and intuitive control, modular control, modifiable, expandable, and can be remotely monitored by the upper computer. The electrical materials are all from internationally renowned brands.

Categories

202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
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