Smiths Interconnect

Singapore,  Singapore
https://smithsinterconnect.com

• Booth: B1726

Welcome to discover the most advanced semi test sockets

Overview

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage.

Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology.

Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.

Smiths Interconnect is part of Smiths Group plc, a global leader in applying advanced technologies for markets in threat and ontraband detection, energy, communications and engineered components.

  Press Releases

• Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards (Mar 31, 2025)

  Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics Achievement Awards (GEAA) ceremony held at the Four Seasons Hotel in Shenzhen. This annual event honors industry leaders and companies making significant contributions to global electronics innovation.

  Organized by ASPENCORE, the Global Electronics Achievement Awards recognizes the industry's elite, including companies, managers, and products that have demonstrated exceptional performance and leadership. The award review committee, comprising senior ASPENCORE industry analysts and user groups from Asia, the United States, and Europe, selected the DaVinci 112 test socket for its outstanding commercial performance and technical innovation.

  Representing Smiths Interconnect at the ceremony were Frank Zhou, Global R&D Director, and Eason Xu, Sales Director of China Semiconductor Testing Division. Together with industry peers, they celebrated the achievements of the year and the bright future of semiconductor technology.

  

  Smith Interconnect Global R&D Director Frank Zhou came to the stage to receive the award

  The DaVinci 112 high-speed test socket is engineered to meet the rigorous demands of chip testing. It supports large-size chips up to 130x130mm with more than 30,000 input/outputs and a coplanarity tolerance of up to 0.65mm, effectively preventing connection issues due to poor coplanarity and ensuring superior signal integrity.

  Smiths Interconnect’s R&D team developed an innovative mechanical structure to prevent socket warping, a common challenge in high pin-count and high-power testing applications. This design enhancement guarantees reliable ground contact, delivering improved power transmission and signal isolation. Additionally, the DaVinci 112’s use of advanced IM conductive materials offers robust mechanical stability, making it an ideal choice for high-speed, high-power chip testing in sectors such as high-performance computing, data centers, and mobile devices.

  Frank Zhou, Global R&D Director of Smiths Interconnect Semiconductor Test Division, shared his pride in the DaVinci 112’s recognition, stating, “We are honored by the positive feedback from both customers and the market. Smiths Interconnect remains committed to pushing the boundaries of technology, embracing innovation, and prioritizing customer needs as we look forward to introducing the next game-changing products in our DaVinci series.”

  

• Smiths Interconnect: Leading the Way in Burn-In Socket Testing Solutions (Mar 31, 2025)

  A Strategic Acquisition in 2023

  In early 2023, Smiths Interconnect solidified its position as a global leader in semiconductor testing solutions by acquiring Plastronics, a renowned brand in the burn-in test socket field. This acquisition significantly expanded Smiths Interconnect’s product portfolio and market share, particularly in the burn-in test socket market.

  As a pioneer in semiconductor test socket manufacturing, Smiths Interconnect has long been at the forefront of high-end testing applications for markets including high-performance computing and AI chips, smartphones, PCs, communications, and enterprise-level data centers. Notably, the DaVinci series high-speed test sockets that deliver unmatched performance in terms of pin count and fine pitch, reinforcing its leadership in high-speed testing.

  With the addition of Plastronics’ expertise and product offerings, Smiths Interconnect is now better equipped to provide comprehensive testing solutions, meeting diverse customer needs.

  

  Plastronics: A Legacy of Innovation

  With over 50 years of experience, Plastronics has been a trusted name in the burn-in test industry, boasting the largest library of QFN product test socket part numbers. Its innovative product line includes burn-in test sockets, patented spring probes, and custom interface connectors tailored for industrial applications.

  Central to Plastronics' success is the H-pin technology, a patented stamped spring probe that surpasses traditional spring probes in mechanical, electrical, and thermal performance. This design also enables cost-effective, automated mass production, making it a standout innovation in the industry.

  The Importance of Burn-In Testing

  Semiconductor chips, often called the "brains" of electronic devices, play a crucial role in delivering seamless user experiences. The burn-in test is vital for ensuring the reliability of these chips, allowing manufacturers to identify potential defects early in the production process.

  By subjecting chips to extreme conditions such as high temperatures (100-150°C), low temperatures, or accelerated aging tests, Smiths Interconnect ensures product reliability, reduces failure rates, and enhances customer satisfaction. These rigorous tests not only improve product quality but also enable design and manufacturing refinements.

  

  Why Choose Smiths Interconnect’s Burn-In Test Solutions?

  Smiths Interconnect’s burn-in test sockets offer several advantages:

  1. Comprehensive Portfolio: From QFN burn-in test sockets (top-open and clamshell designs) to BGA/LGA solutions, Smiths Interconnect caters to a wide range of customer needs and budgets.
  2. Fast Lead Times: Industry-leading turnaround of 3-4 weeks for standard QFN test sockets ensures timely delivery for mass production.
  3. Cost-Effective H-Pin Technology: Customers benefit from reduced costs, as damaged H-pins can be replaced individually without discarding the entire socket. These sockets also perform well at high temperatures (up to 180°C).
  4. Flexible Manufacturing: Options include both machined and molded components, reducing production cycles and costs.
  5. Extreme Temperature Range: H-pin test sockets operate reliably across -55°C to 260°C.
  6. Global Support: A robust global sales network and round-the-clock technical support ensure seamless service.

  These solutions cater to diverse industries, including automotive electronics, computer technology, and laboratory IC programming, offering both high-volume and customized solutions.

  

  Looking Ahead

  As the demand for consumer electronics, AI-driven technologies, and high-performance computing rebounds, Smiths Interconnect is poised for growth. Innovations in large package sizes, high pin counts, and power consumption optimization in GPUs, CPUs, and HPCs position the company as a leader in the next generation of semiconductor testing solutions.

  To learn more about Smiths Interconnect’s industry-leading burn-in testing solutions, Click Here

  

  Products