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YINCAE Advanced Materials, LLC

Albany,  NY 
United States
http://www.yincae.com/
  • Booth: B2939

YINCAE #B2939: Microchip & Opto Solutions (Wafer to Board)

Overview

YINCAE  is a leading manufacturer and supplier of adhesives and electronic materials used in microchip and optoelectronic devices. YINCAE products provide innovative technologies to support manufacturing processes at wafer level, package level and board level.

Key Categories & Product Highlights

  1. Board Level Assembly Materials – Enhance PCB assembly, ensuring strong, reliable connections
    • NC 256 – Zero-residue flux for microchip applications
    • SMT 256 – Dip adhesive that enhances solder joint reliability in CSP, BGA, and flip-chip
    • SMT 256EP- Solder Joint encapsulant paste, lower temperature soldering for higher temperature application
  2. Underfill Materials – Encapsulate solder joints to improve mechanical support and thermal resistance
    • UF 120LA – Compatible with no-clean solder paste flux residues, eliminating cleaning processes
    • UF 88UL – Provides excellent thermal cycling resistance for fine-pitch and large-area components
    • UF 158A2 – Fast-curing, low-viscosity underfill offering superior moisture protection
    • UF 158HA – High-adhesion underfill for strong bond strength and thermal stability
  3. Die Attach Adhesives – Bond semiconductor dies to substrates for optimal heat dissipation and mechanical stability
    • DA 90 – A silver-filled, high thermal conductive, solvent-free, and fast-curing thermosetting die attach adhesive
    • TM 150E – Solderable conductive adhesive designed for die attach applications
    • TM 150EB – A solderable conductive adhesive that is self-filling, self-leveling, and self-soldering
    • TM 158D – A diamond-filled, high thermal conductive adhesive
  4. Wafer Level Materials – Essential for advanced semiconductor packaging
    • WL 125 – A pre-applied wafer-level underfill designed for wafer-to-wafer, chip-to-wafer, chip-to-chip, and chip-to-substrate
  5. Optoelectronic Materials – Used in devices that convert electrical signals to optical ones (e.g., LEDs)
    • LEN 66AL – High-performance underfill for advanced electronic packaging.
  6. Thermal Interface Materials – Improve heat transfer and maintain device temperatures.
    • TM 158 – A diamond-filled, high thermal conductive adhesive
    • TM 150E – Solderable conductive adhesive designed for LED, CSP, QFP, and thermal interface materials
    • TGP 110 – A series of thermal conductive adhesives that act as reactive thermal grease

  Press Releases

  • YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

    UF 120LA withstands 5x260°C reflow cycles without solder joint deformation, outperforming competitors requiring cleaning. Its snap cure at lower temperatures enhances production efficiency, making it ideal for memory cards, chip carriers, and hybrid circuits.

    UF 120LA’s superior thermal resistance and mechanical durability empower manufacturers to develop more compact, reliable, and high-performance devices, accelerating trends in miniaturization, edge computing, and IoT connectivity. This advancement can enhance the production of mission-critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems, and wearable technology, where reliability and longevity are paramount. Additionally, by streamlining manufacturing workflows, UF 120LA enables faster time-to-market for consumer electronics, potentially reshaping supply chain efficiencies and creating new opportunities for economies of scale.

    In the long term, the widespread adoption of this technology could revolutionize the semiconductor packaging landscape, paving the way for increasingly sophisticated electronic devices that are lighter, more efficient, and more resilient in extreme environments.

    Key Benefits:

    • No-clean compatibility – Works with all no-clean solder paste flux residues.
    • Cost savings – Eliminates cleaning processes and pollution.
    • High thermal reliability – Withstands multiple reflow cycles without deformation.
    • Superior flowability – Fills narrow gaps as small as 20μ.
    • Less warpage – low CTE and high thermal stability.

    "The UF 120LA represents a significant leap forward in electronics packaging technology," said YINCAE’s Chief Technology Officer. “UF 120LA empowers manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-level chip scale packages. We believe this product will set a new industry standard for performance and efficiency."

    YINCAE’s UF 120LA is available immediately for purchase. For more information on YINCAE’s UF 120LA underfill, or to learn more about the YINCAE product range, please email us at: [email protected]. You can also find more information by visiting our website: www.yincae.com

  • 03/11/2025 (Albany, NY) - YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

    UF 158UL boasts exceptional flowability, allowing it to effortlessly fill gaps as small as 10 microns, even in large 100x100 mm chips. Its unique formulation ensures rapid curing at room temperature, significantly reducing production time and energy costs. Moreover, UF 158UL exhibits superior reliability, providing robust protection against thermal stress, moisture, and mechanical shock, ensuring long-term device performance.

    "We are thrilled to introduce UF 158UL, a game-changer in underfill technology," said CTO of YINCAE, "With its exceptional flow, fast cure, and high reliability, UF 158UL empowers manufacturers to achieve unprecedented levels of efficiency and quality in the production of large format chips."

    UF 158UL is ideal for a wide range of applications, including:

    • High-performance computing
    • Artificial intelligence
    • Automotive electronics
    • Aerospace systems

    Key Features and Benefits:

    • Room temperature flow for easy application
    • Fast cure for increased throughput
    • High reliability for long-term performance
    • Excellent gap fill in 10-micron spaces
    • Compatible with large 100x100 mm chips

    YINCAE’s UF 158UL is available immediately for purchase. For more information on YINCAE’s UF 158UL underfill, or to learn more about the YINCAE product range, please email us at: [email protected]. You can also find more information by visiting our website: www.yincae.com

    * * * * * * * * * *

  • YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

    5/15/2025 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.

    UF 120HA offers several key benefits:

    • Fully compatible with all no-clean solder paste flux residue
    • Eliminating the cleaning process and its pollution
    • Lower temperature snap cure (<120 ºC)
    • Passes 5×260 ºC reflow without any deformation of the solder joint
    • Better than all competitors' underfill with a cleaning process
    • Lower CTE and able to flow into small gaps
    • Reworkable
    • Large cost savings

    "Our team is excited to introduce UF 120HA to the market," said YINCAE's Chief Technology Officer. "We understand the challenges facing manufacturers today, and we have designed this product to address those challenges head-on. UF 120HA offers fast flow, low-temperature cure, compatibility with all no-clean flux residue, and reworkability, making it an ideal solution for a wide range of high-throughput manufacturing applications."

    YINCAE’s UF 120HA is available immediately for purchase. For more information on YINCAE’s UF 120HA underfill, or to learn more about the YINCAE product range, please email us at: [email protected]. You can also find more information by visiting our website at: www.yincae.com

    Connect with YINCAE:

    To schedule a 1:1 with our materials specialists at SEMICON Southeast Asia 2025, please email [email protected].  

    * * * * * * * * * *

     Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

  • 05/15/2025 (Albany, New York) -YINCAE Advanced Materials is thrilled to announce its participation in SEMICON Southeast Asia 2025, where it will showcase a comprehensive portfolio of high-performance materials engineered to meet the rapidly evolving demands of the semiconductor and microelectronics industries.

    Visit Booth #B2939 to explore YINCAE’s latest innovations spanning board-level assembly, underfill, die attach adhesives, wafer-level solutions, optoelectronic materials, and thermal interface technologies. YINCAE's technical team will be on-site to demonstrate how its materials are enabling advancements across key sectors including automotive, aerospace, defense, telecommunications (5G/6G), AI, and consumer electronics.

    Featured Technologies:

    Board Level Assembly Materials – Strengthen PCB assembly with reliable, high-performance materials:

    • NC 256 – Zero-residue flux designed for microchip applications.
    • SMT 256 – Dip adhesive that enhances solder joint reliability in CSP, BGA, and flip-chip assemblies.
    • SMT 256EP- Solder Joint encapsulant paste, lower temperature soldering for higher temperature application

    Underfill Materials – Provide enhanced mechanical support and thermal resistance for solder joints:

    • UF 120HA: Snap Cure, Highly Filled, 100% No-Clean Flux Residue Compatible
    • UF 120LA – Compatible with no-clean solder paste flux residues, eliminating cleaning processes.
    • UF 88UL – Excellent thermal cycling resistance for fine-pitch and large-area components.
    • UF 158A2 – Fast-curing, low-viscosity underfill offering superior moisture protection.
    • UF 158HA – High-adhesion underfill for strong bond strength and thermal stability.

    Die Attach Adhesives – Bond semiconductor dies to substrates for optimal heat dissipation and mechanical stability:

    • DA 90 – Silver-filled, high-thermal-conductive, solvent-free, and fast-curing thermosetting die attach adhesive.
    • TM 150E – Solderable conductive adhesive designed for die attach applications.
    • TM 150EB – Self-filling, self-leveling, self-soldering solderable conductive adhesive.
    • TM 158D – Diamond-filled, high-thermal-conductive adhesive.

    Wafer Level Materials – Essential solutions for advanced semiconductor packaging:

    • WL 125 – Pre-applied wafer-level underfill designed for wafer-to-wafer, chip-to-wafer, chip-to-chip, and chip-to-substrate bonding.

    Optoelectronic Materials – Advanced materials for devices converting electrical signals to optical signals (e.g., LEDs):

    • LEN 66AL – High-performance underfill for advanced electronic packaging.

    Thermal Interface Materials – Enhance heat transfer and maintain device temperatures:

    • TM 158 – Diamond-filled, high-thermal-conductive adhesive.
    • TM 150E – Solderable conductive adhesive ideal for LED, CSP, QFP, and thermal interface applications.
    • TGP 110 – A series of thermal conductive adhesives that function as reactive thermal grease.

    Connect with YINCAE:

    To schedule a 1:1 with our materials specialists at SEMICON Southeast Asia 2025, please email [email protected].  For more information and technical specifications, visit www.yincae.com.

    * * * * * * * * * *

    About YINCAE Advanced Materials

    Founded in 2005 and headquartered in Albany, New York, YINCAE is a global leader in the development of high-performance coatings, adhesives, and electronic materials. Supporting the full manufacturing spectrum—from wafer to board to final device—YINCAE empowers faster, smarter production while promoting sustainable practices across the electronics supply chain.

  • Albany, New York – May 21, 2025 – As Day 2 of SEMICON Southeast Asia 2025 kicks into high gear, YINCAE Advanced Materials is emerging as a must-see exhibitor at Booth #B2939. Making its debut in Southeast Asia, YINCAE is drawing strong interest with its advanced materials engineered for next-gen applications in 5G, AI, automotive, aerospace, and high-reliability electronics.

    From high-performance underfills and thermal solutions to revolutionary die attach adhesives and zero-clean fluxes, YINCAE is delivering what engineers and manufacturers are actively looking for: solutions that enable smarter, faster, and more durable electronic assemblies.

    “Our team has had incredible conversations with innovators from across the region,” said Dr. Wusheng Yin, President of YINCAE. “They’re not just browsing — they’re bringing real challenges, and we’re delivering real answers.”

    With only one day left, now is the time to explore how YINCAE can help you:

    • Boost reliability in harsh environments

    • Accelerate production timelines

    • Solve complex assembly challenges

    • Gain a technical edge in your next product launch

    You won’t regret stopping by — you’ll leave with solutions that can move your project forward immediately.

    🚀 Don’t miss your chance — SEMICON SEA wraps up tomorrow. Visit YINCAE at Booth #B2939 before it’s over!

  Products

  • Underfill UF 158HA
    UF 158HA is a highly filled and high purity liquid epoxy underfill which can flow into
    narrow gap. UF 158HA is fully compatible with all no-clean solder paste flux residue and
    pass 5x260C reflow without any solder joint deformation...

    • UF 158HA is a highly filled and high purity liquid epoxy underfill which can flow into narrow gap. UF 158HA is fully compatible with all no-clean solder paste flux residue and pass 5x260°C reflow without any solder joint deformation, and it has performed better than all competitors’ underfill with cleaning process. This material can be used for BGA, flip chip, wafer-level chip scale package application and bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. The benefits of using UF 158HA are:

    • Fully compatible with all no-clean solder paste flux reside

    • Eliminating cleaning process and its pollution

    • Large cost saving

    • Pass 5x260 ºC without any deformation of solder joint

    • Better than all competitors’ underfill with cleaning process

    • Be able to flow into 20 μ gap

    • No resin bleeding

     UF 158HA is designed for high production and friendly environment where process speed, mechanical shock and reliability are key concerns.

  • Thermal Underfill UF 158A2
    UF 158A2 is an advanced thermal underfill material engineered for high-performance applications across a wide range of electronic devices...

    • UF 158A2 is a high-performance thermal underfill solution designed for a wide range of electronic devices. Ideal for CoWoS packages, this versatile material replaces underfill, silver epoxy paste, and thermal pads/paste in one efficient step. It enhances protection and thermal management for critical components, improving the structural integrity of assemblies and reducing stress on solder joints by filling the space between the device and the PCB (Printed Circuit Board).

    This encapsulant is perfect for high-reliability applications where temperature cycling, shock, and vibration can threaten the durability of electronic components. UF 158A2 offers exceptional thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.

    UF 158A2 is a thermally conductive, capillary flow underfill with rapid curing properties, making it suitable for flip chip, chip scale packages, ball grid arrays (BGAs), package-on-package (PoP) applications, and land grid arrays (LGAs). It is also ideal for bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits, and multi-chip modules. Designed for high-volume production, it supports fast processes and provides mechanical shock resistance, ensuring excellent temperature cycling performance and reliability.

    Key Benefits:

    Fast Flow & Easy Application: Perfect for underfilling 100x100 mm chips (with a 20m gap).
    Shortens Manufacturing Process: Improves production efficiency.
    High Thermal Conductivity: 3-4 W/mK for superior thermal management.
    Snap Cure & Reworkable: Provides flexibility and ease of use.
    Cost-Effective: Significant cost savings while delivering excellent thermal management performance.
    UF 158A2 is the ideal solution for manufacturers looking for a reliable, efficient, and cost-effective material for their thermal management needs.

  • Die Attach Adhesive DA 158N
    DA 158N is an electrical insulating and thermal conductive die attach adhesive. It can be cured at lower temperature. This material is designed for extremely harsh die attach
    application...

    • DA158N is a high-performance die attach adhesive that combines exceptional thermal conductivity with electrical insulation. It is specially designed for fast curing at low temperatures, making it ideal for a wide range of applications, including extreme environments such as space missions, where durability and reliability are critical.

    Developed with the vision of supporting future technologies, including those for Mars exploration, DA158N stands out for its unique properties. It offers high thermal conductivity, enabling thin bonding lines without any bleeding or migration issues. Additionally, it provides superior bonding strength and exceptional thermal cycling performance—outpacing leading competitors in the market. DA158N can endure extreme temperatures as low as -273°C without delaminating, maintaining reliable performance in even the harshest conditions.

    This adhesive is perfect for all die attach applications, particularly those in harsh environments. It also serves as an excellent protective layer for bare chips in advanced packages, including memory cards, chip carriers, hybrid circuits, and multi-chip modules.

    Designed for high-volume production and efficient processes, DA158N excels in environments where speed, reliability, and mechanical shock resistance are key concerns. It is easily dispensed, minimizes induced stresses, and ensures outstanding performance in temperature cycling and mechanical resistance.

    Key Features:

    • Thermal Conductivity & Electrical Insulation: Perfect for high-performance applications.
    • Low-Temperature Curing: Fast curing for efficient production.
    • Superior Thermal Cycling Performance: Outperforms competitors in extreme temperature conditions.
    • Exceptional Bonding Strength: No delamination, even at -273°C.
    • Easy Dispensing & Minimal Stress: Ensures high-quality results with reduced risk of stress-induced failure.

    DA158N is the ultimate choice for die attach applications in extreme conditions, offering long-lasting reliability and performance for industries ranging from space exploration to advanced electronics manufacturing.

  • Capillary underfill UF 88UL
    UF 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room
    temperature without preheating a substrate....

    • UF 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured UF 88UL can be easily reworked. UF 88UL not only can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are the key concern. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance. The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste.
  • Capillary underfill UF 158UL
    UF 158UL is a super fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate...

    • UF 158UL is a super fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured UF 158UL can be easily reworked. UF 158UL not only can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are the key concern. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance. The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste.  

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Molding; Encapsulation; Potting; Resin Materials
  • Solder; Solder Balls and other Soldering Materials
  • Thermal Interface Materials; Heat Sinks
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