Nidec SV Probe Pte. Ltd.

MEMS probe card technology is one of the fastest-growing probing segments for some of the most innovative, leading-edge devices for AI, Mobile and Automotive. Leveraging our proprietary MEMSFlex^TM probe capabilities for a variety of probe card testing applications, Nidec SV Probe is also continuing to discover new ways to solve challenging test issues with these probes, including RF/High Current capabilities and memory testing.

Nidec SV Probe's MEMSFlex^TM probes are fully customizable for force, stroke, overdrive and tip style, optimized to your specific testing requirements. Utilizing a continuous, automated manufacturing process, we are capable of supporting a wide array of custom pin pitches and specifications within a short cycle. With our MEMS probes, we are able to achieve pitches down to 60µm and can accommodate a variety of device testing applications.

Nidec SV Probe's Multiplexer probe cards, a hybrid cantilever/vertical structure, are built with cantilever needles held into place on one side by epoxy resin. In addition, shorter probes lead to a more stable electrical characterization over other CIS probe card options. Multiplexer cards also provide, support up to 64 DUTs, with stable electrical characteristics, better touchdown efficiency and precise lens integration.

There has been a rapid expansion within the Power device market as Electrical Vehicles (EV), cloud computing and renewable energy become increasingly more important and in demand.

As these segments continue to drive the Power IC market, preventing unwanted electrical discharge (arcing) during test is crucial. High voltage and high current wafer probing can both cause probe sparking, ultimately leading to damage to the device or the probe card.

In order to meet the testing requirements for complex power devices, Nidec SV Probe’s new Chamber Head product applies anti-electrical technology directly to the probe card to prevent arcing. The probe card is built with a pressurized chamber that can withstand the increased voltage during test.

Determining the operating temperature of individual semiconductor devices can be a challenge during the wafer testing process because the temperature can vary from chip to chip. Nidec SV Probe’s TC (ThermoCouple) Probes apply Thermocouple technology within the probe, including an embedded temperature sensor consisting of two different metal conductors for wafer temperature measurement. Finding this temperature variance can now be achieved faster and more efficiently, specifically to make these temperature measurement decisions easier.