Rui Yin (HK) Co., Limited

Cutting-edge mechanical precision and unparalleled reliability

Cutting-edge capability for 500 kgf shear force testing; Customizable options for 1000 kgf and 2000 kgf shear force testing

High-power Integrated Circuit Packaging (IGBT), Circuit Manufacturing, Adhesive Manufacturing, etc.

 Technology Highlights

Non-destructive wire pull testing with industry-exclusive L3-level vision system,automatically and precisely capture the position of the tested wire through visual recognition

Industry-exclusive solution capable of automatic testing for products manufactured by manual Wire Bond and Die Bond equipment

Industry-exclusive solution capable of performing non-destructive automatic wire pull testing for micro-wires with tensions as low as 3.6gf/2.4gf

Visual recognition accuracy > 98%, with recognition time < 100ms

Shear height accuracy: ±1 μm

System measurement accuracy: ±0.1% FS

Technical Highlights:

*Industry-Leading Fully Automated Wafer-Level Packaging and Testing Equipment without human intervention

*7x24 Hour Uninterrupted Operation with Sustained Productivity

*WPH (Wafers Per Hour) up to 25 PCS

*Exclusive Slot Recipe Technology with PPH = 25 (parts per hour).

*Shear height accuracy: ±1 μm /±0.5 μm.

*System measurement accuracy: ±0.1% FS / ±0.05% FS (Full Scale).