Dongguan HEF Mechanical Electrical Equipment Co.,Ltd

Dongguan Shi,  China
http://www.dghef.com
  • Booth: L2810

Chip innovation,anything is possible.

Overview

Seiko technology, creating extraordinary. HEF technology makes your cutting process smooth and efficient!

Dongguan HEF Mechanical Electrical Equipment Co., Ltd., established in 2008,is a national high-tech enterprise with ISO9001:2008 system certification.We specialize in providing semiconductor cutting solutions, HEF dicing blades, cutting peripheral equipment and consumables, and are committed to eliminating process defects and improving the process for our customers. The company has a senior research and development team for semiconductor material cutting, which can provide high-quality technical support services in the cutting process, such as wafer dicing machine installation, precision dicing machine maintenance, semiconductor material cutting, as well as the design of the best process for new products, equipment transformation with specified goals.

Our main products include: HEF blade series, wafer cleaner, spindle, UV tape and UV machine, dicing machine special working plate, cutting tape, special working plate, frame, and cassette, etc. Among them, HEF dicing blade has become a well-known brand in the domestic  industry. It is widely  used for cutting semiconductor materials such as wafers, MOS transistors, ICs, DFNs, QFNs, etc. HEF dicing blade has achieved a minimum thickness of 15um, and its diamond particle size is subdivided into 11 types, 5 diamond concentrations, and 3 bond hardness. 

Customer First, Continuous Operation! HEF takes high-tech dicing blade as the vanguard and the planning of cutting plans as the main body. In response to difficult cutting problems, it has embarked on a practical development path.Currently,it has served major well-known manufacturers and supporting customers around the world.

Taking advantage of the explosive trend in China's semiconductor industry and with the dedicated craftsmanship spirit of HEF people, we will continue to focus on the semiconductor industry, keep up with the times, and continuously  research and  innovate.  HEF  people  help customers grow while also growing together with them, making every surpass and expectation the goal of every HEF person!


  Products

  • 划片刀 Dicing saw blades
    Applications
    Silicon wafer、compoundsemiconductor wafers(GaAs、GaP)、oxide wafer(LiTa03) and others....

  • Product features
    After several years ofdevelopment,HEF dicing blade has been achieved.
    The main performance indicators correspond one-to-one with DISCO/K&S.
    Diamond, like DlSCO, has 5 concentrations and 11 particle subdivisions.
    The thinnest blade can reach 13um.
    Successfully achieved large-scale cutting applications in the hard knife field.

    Applications
    Silicon wafer、compoundsemiconductor wafers(GaAs、GaP)、oxide wafer(LiTa03) and others.

  • Nickel Blades for Package singulation
    Applications
    Alumina ceramics、EMC、PCB and various semiconductor packagebase plate....

  • Main features
    A combination of nickel bond and larger sizediamond grits provides long blade lifeperformance.

    Applications
    Alumina ceramics、EMC、PCB and various semiconductor packagebase plate.

  • Resin Bond Dicing Blades
    Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz
    glass,ceramics and so on....

  • Product overview
    Resin bond dicing blades without steel core is mainly used for precision cuting and sloting for semiconductor, optical glass, quartz glass,ceramics and so on.

    Main features
    Sharpness cutting and elastic bond can improve the surface quality. High precision,less dress or no need to dress.Widely used, variety specifications, short delivery time.

    Application
    ZS001 series is suitable for semiconductor component(QFN、DFN), which canavoid burrs, and improve efficiency and life.

    ZS002 series is suitable for optical glass, which can avoid chip and improve yield.

    ZS003 series is suitable for quartz glass, which can avoid chips and improve efficiency, and finish of product.
    ZS004 series is suitable for ceramics, which can avoid chips and cracks, andimprove the processing quality.
    Other series are suitable for slotting and cutting of crystal, magnetic materials, carbide and some other difficult to cut metal materials with excellent cutting quality.

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