E&R: Taiwan's Leader in Laser & Plasma Innovation! #L2413
Overview
Company Profile
Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp. has been
delivering advanced laser and plasma solutions to the semiconductor industry for 30 years.
Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, ABF micromachining,
and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support.
With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,
and Europe, we provide swift support and continuous process optimization.
Products & Services
Laser Application, Plasma Solution, TGV, FOPLP, FOWLP, AOI, Carrier Tape
We have formed the Glass Substrate E-Core System Alliance, leveraging our self-developed TGV technology
to support glass panels (up to 515x510mm, 0.2-1.1mm thickness) with via processing speeds of up to 8,000 vias per second
for fixed patterns and 600-1,000 vias per second for customized patterns. Additionally, we provide laser beveling and polishing
for post-ABF glass. In FOPLP, our mass-production equipment covers laser cutting, plasma cleaning, and warpage handling.
Our hybrid laser-plasma solution for small die dicing ensures high precision and supports diverse die shapes.