ESTEK AUTOMATION SDN BHD

UPH

• Up to 5K (Depend on inspection criteria)

Handling Input Tray Type

• Waffle Tray / Special Tray

Handling Output Type

• Waffle Tray

Reject Tray

• 5 Bin Waffle Tray

Pick & Place Head

• 2

Dark Field Light (Vision)

• Available 

Bright Field Light (Vision)

• Available

Lens Size Range

• Up to 2mm x 2mm

Place Accuracy

• +/- 20um

Camera

• 25M Color Camera
• 100M Colour Camera with Pixel Shifting Technology
• 2um Resolution

Lens

• Tele Centric Lens

Lightings

• Full Color RGB
• Co-Axial
• Back Light

Facilities

• Voltage - 220VAC Single Phase
• Frequency - 50/60 Hz
• Power Consumption - 2.4KVA
• Temperature - 20 - 300ºC
• Humidity - 18 - 70% RH Non-Condensing
• CDA - 6 Bar 200L/M

System Capability

• UPH up to 1.8K
• Able to differenciate the defects layer (on glass, under glass, on die)

Packages

• CMOS Sensor

Loading & Unloading Module

• Up to 300mm x 100mm substrate/ Lead frame size

Defect Inspection Capabilities

• Glass offset
• Particle on die
• Die scratch
• Glass strach and crack 
• Sagging/ Sway wire
• Damage wire
• Watermark
• Particle under glass
• Die contamination
• Incomplete epoxy
• Seal gap/ epoxy overflow

Facilities

• Single phase AC 220V, 10A
• 6 Bar CDA 200L/min
• Vacuum - 80kPa @ 500 L/min
• Humidity 18 - 70% RH Non - Condensing
• 20 - 30ºC

UPH

• Up to 15k

Unit Size 

• Up to 1.5mm

Unit Thickness

• 0.07mm to 1.5mm

Input Type 

• Wafer frame (Up to 12 inch Wafer)
• Detapper 8mm Tape Width

Output Type

• Tape & Reel 8mm Tape Width

Reject Type

• Multi Reject Bins