AKABANE SANGYO CORPORATION

kita-ku,  Tokyo 
Japan
https://www.akabane-sangyo.co.jp/
  • Booth: B1931

Welcome to Akabane Sangyo Corporation webpage on SEMICON SEA

Overview

Akabane Sangyo Corporation is a professional supplier in PCB, IC substrate and advanced package. Akabane provides equipment and materials from Europe, Korea, Taiwan and China mainland, offer after sales service such as equiment installation, setup, maintenance, repair etc. besides before sales technical support. Akabane is your best partner for advanced production. 


  Products

  • RTR Plating Line for Lead frame
    Plating line for lead frame application supplied by Akabane Sangyo Corporation.
    ...

  • Suitable for terminal and lead frame application
    High pressure desmear unit for semiconductor application
    Spot jet, strip jet and spray Jet selectable
    Deposition of precious metals, such as Cu, Sn, Au, Ag
  • Warpage Inspection Machine
    Warpage inspection machine for FCBGA substrate...

    • New generation laser head, wider scanning rage, faster image capture speed.

      ★新世代鐳射頭,更寬的掃描範圍,更快的取像速率;

      Min. blind area optical design, complete image captured, without occlusion problem;

      ★最小盲區光學設計,擷取影像更完整,無遮蔽之問題;

      Full-journey dual vehicles, reduce operation wait time, enhance production efficiency.

      ★全行程雙台車,減少作業等待時間、提升產能效率;

      Inspection repeatness: warpage±4um, coplanarity±4um;

      ★量測重複性:warpage±4um,Coplanarity±4um,

      Inspection accuracy: warpage±5um, coplanarity±5um;

      ★量測精度:warpage±5um,coplanarity±5um;

  • Solder Bump Inspection Machine
    Used to measure the height, diameter and coplanarity of solder bump...

  • High measurement accuracy, high stability;

    ★高量測精度,高穩定性;

    Handle different types of bumps, no need to change laser head;

    ★對應不同各類Bump,不需要更換鐳射頭;

    Fast image capture technology, dual-sensor receiver, complete image without occlusion problem;

    ★快速取像技術,雙SENSOR接收,影像完整,無遮蔽;

    Small footprint, No limit to bump pitch measurement capability

    ★高度小,Pitch bump測量能力不受限制;

  • Three stage vacuum lamination equipment
    Three stage vacuum lamination equipment used for semiconductor industry...

  • Full Auto temporary lamination & three stage vacuum lamination equipment

    ★全自動預貼&三段真空壓合設備

    Super high flatness, special rubber type lamination technology & servo drive for upgrading flatness.

    ★特殊橡膠壓合式層壓技術&伺服驅動進一步整平設計,超高平坦度

    Ultra high sealness

    ★超高氣密性

    Handle super high layers

    ★對應超高層積

  • EFEM Handling with Auto Peeler
    Fully automatic peeler for organic substrate or glass substrate...

    • Peeling PET-film from both sides simultaneously and single sided (top or bottom)

    可單面/雙面撕膜

    • Suitable for Dielectric or Build-up Films (ABF, DRF, SR, etc.)

    適用於中介層或BU層撕膜(ABF, DRF, SR,等等)

    • Base material can be substrates panels or glass panels

    基材可以是有機基板或玻璃基板

    • Fully automatic peeling system as a standalone solution

    全自動撕膜系統

    • EFEM handling with integrated camera system for ID-recognition

    EFEM入料,可集成相機系統進行ID識別

  • X-ray inspection machine
    X-RAY Inspection Machine...

  • Internal inspection with zero blind areas with diagonal CT imaging

    傾斜CT成像檢查設備,零盲區內部檢查

    High resolution / High throughput

    高精度、高產能

    360-degree scanning capability with a rotary stage

    配旋轉臺面,可360°掃描

    Hybrid scanning combining oblique viewing and a rotating stage

    綜合傾斜檢查和旋轉臺面檢查兩種掃描方式

    Auto-detection of stage center position

    自動偵測平臺中心位置

    Marker offset function

    標記偏移功能

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