Actualising Through Technology and Innovation!
Overview
Inari Amertron Berhad ("Our Group" or "The Group") is principally involved as an outsourced semiconductor assembly and test (OSAT) service provider for Radio Frequency (RF), Fiber-optics transceivers, Opto-electronics, sensors and custom IC technologies. Our Group's major undertakings include:
- Wafer processing covers probing, laser marking, die sawing, back grinding, flip-chip dice tape & reel and automated visual inspection (AVI).
- Chip Fabrication and Wafer Certification in Fiber Optic chips covering wafer scribe & cleave, bar aligning, demount-load fixtures and facet coating and chip on carrier (COC)
- Advanced System in Package (SIP) assembly and test include fine-pitch surface mount technology (SMT), high speed & high accuracy flip-chip dice placement, in line post vision, molding under fill (MUF) and post mold oxide plating, and final testing.
- Other services include Sensor and IC Package design and characterisation, process customization and assembly, product testing, box build and direct customer drop-ship.
The Group operates 11 plants situated regionally across three countries namely Malaysia, Philippines and China with facilities totalling floor space of more than 2,150,000 square feet, and with a workforce of more than 6,000 spread across the region.
Our Group takes a holistic approach in executing our growth plans strategically as we continiously explore opportunities to expand through value-accretive investments in production capacity and technolgoy innovation, enhancing capabilities and manufacturing processes, nurturing a strong talent pool, incorporating sustainability measures and implementing best practices across our operations and organizational structures.