Indium Corporation

NC-809 Flux is a halogen-free, no-clean, ultra-low residue flip-chip flux, which is designed to leave minimal residue while maintaining proper wetting and exhibiting high tackiness. The reduction in residue optimizes underfill adhesion and decreases void formation by reducing outgassing in the underfill curing process. NC-809 Flux exhibits proper wetting due to its specially designed manufacturing process, which makes the material suitable for both flip-chip dipping applications and certain wafer-level BGA ball-mount applications. NC-809 Flux has high tackiness, which makes this material suitable to hold die in place during assembly, preventing shifting or skewing-related defects.

Key Features

 • Excellent wetting performance

• Ultra-low residue

• Compatible with flip-chip and certain ball-attach applications

• High tack

• Compatible with a wide variety of underfills

• Dipping with minimal bridging

• Halogen-free

• No-clean

Durafuse® HT is our cutting-edge pb-free solder paste crafted as a seamless substitute for traditional high-Pb die-attach solders. It eliminates the need for higher remelt temperatures, peaking at 260°C—well above typical PCBA reflow conditions. Featuring a dynamic alloy blend, it excels in thermal cycling, maintaining shear strength exceeding 15MPa, even under temperatures nearing 280°C.  Durafuse® HT's enhanced electrical and thermal performance sets a new standard in soldering innovation.