ITEC - YOUR SEMICONDUCTOR EQUIPMENT AND AUTOMATION PARTNER
Overview
High-accuracy, high-speed, high-quality semiconductor finishing processes—that’s ITEC. We combine state-of-the-art equipment and automation expertise with 30-plus years of in-company semiconductor manufacturing experience. In the presence of this strong foundation, combined with an entrepreneurial spirit and an innovative team, we are now getting ready for growth in new markets.
From fast, accurate die bonders and sorters for mass-produced semiconductor devices, to high-throughput production testers and highly efficient Automated Optical Inspection (AOI) systems. Plus, our smart manufacturing solution, ITECore, to help maximize your productivity. ITEC gives you a competitive technological edge in semiconductor manufacturing.
At Semicon Southeast Asia we are proud to present our XF die bond platform, capable of bonding at 72,000 UPH direct and a game-changing 60,000 UPH for flip chip.
We’d love to understand your specific challenges and see how we can partner up to supply the breakthrough technology you need.