Overview
About Manz Asia
Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.
From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.
By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.