Mitsubishi Gas Chemical Singapore Pte Ltd

RP System is a high-performance multiple gas absorbing sachet designed to support the semiconductor industry through the protection of the component from oxidation and corrosion. Unlike traditional nitrogen purging and vacuum sealing, the RP System actively removes residual oxygen from within sealed semiconductor packaging thereby creating a low-oxygen environment critical for moisture sensitive devices (MSDs) such as IC Chips, wafers and PCB which significantly reducing oxidation risks. This helps extend storage life and maintain component reliability throughout the supply chain and offer longer-term stability and enhanced protection requirements are now considered essential. It also ensure reduce the risk of performance of issue caused by corrosion and material breakdown such as those found in solders. Because RP system is a sachet, there is no requirement for expensive gas flushing or vacuum system which requires additional equipment. Due to the ease of usage, there is almost no energy consumption making it one of the more sustainable solution.  

Neopulim™ is a solvent-soluble transparent polyimide varnish.
Because imidization is already completed, only solvent volatilization is required.
Neopulim™ offer excellent transparency, high heat-resistance and completely free of fluorine components (PFAS free / non PFAS grades). By taking advantage of these features, Neopulim™™ can be used for displays and various other optical applications.

Advantages

• High Heat Resistance
• High Transparency
• Low Temperature Dry
• PFAS Free
• Free of fluorine components

Therplim is a high performance thermoplastic polyimide which ahs well balance Tg and Tm compared to super engineering plastic (such as PEEK, PEKK). It also offer high strength, heat durability, chemical resistance, Low-K Dielectrics and easy formability. 

The resin also offer good Moldability and low water absorption. 

Therplim is also available as next generation substrate for IC Testing due to its low Dk and superior dimension stability at high temperature.