nXF-3 scans 12-inch full-wafer quickly so that can measure warpage, bow, and stress of wafer.
Also it can perform 2D inspection for dent and wheel mark.
It can not only measure wafers for products such as CoWos or HBM products, but also measure warpage, bow, and stress of die.
It can measure wafer warpage up to 6mm.
Nexensor’s nXScan and nXView are dedicated software for measurement and analysis, respectively.
The measurement surface displays a real-time Live View.
Settings can be easily adjusted, allowing intuitive operation and verification of step height, width, angle, volume, roughness, and flatness in specific areas.