ViTrox Technologies Sdn. Bhd.

• Functionality:
Performs automatic tray-to-tray inspection of 2D, 3D, ball, leadless packages, and passive components, ensuring high-speed, high-performance operation with reliable sorting and minimal maintenance.

Why Choose the TH3000i?
1. Delivers high-speed tray-to-tray inspection for enhanced throughput.
2. Designed for high performance with simple, user-friendly operation.
3. Features automatic reject sorting capability for improved process flow.
4. Offers quick conversion time to reduce downtime during changeovers.
5. Low maintenance cost ensures long-term operational efficiency.

Breakthrough Technologies:
• AI-driven semiconductor inspection for enhanced accuracy and efficiency.
• SWIR technology for high-accuracy microcrack and internal defect detection.
• 4-side inspection for total quality control.
• Future-ready design to support advanced packaging and evolving industry needs.
• 1x14 pick-up nozzles (2x14 optional) enabling machine throughput up to 60K.
• Programmable auto nozzle pitch conversion to minimise setup time.
• Multi-nozzle sorting mechanism with 1x2 fully motorised Z & pitch pick-up arm.
• 2x14 pick-up support for end-lot full row sorting.
• Dual row laser height measurement sensors for accurate double-unit detection.

Applications:
• BGA and QFN component inspection.
• High-speed automated tray-to-tray packaging lines.
• Semiconductor, electronics, and precision component industries. 

Visit Us!
Discover how the TH3000i can boost your inspection line efficiency with advanced automation and intelligent sorting. Visit us at #L2201 to learn more about this cutting-edge vision inspection system.

NPI!

• Functionality:
The PX40i is a next-generation die sorting and vision inspection solution, combining AI-powered infrared technology with high-speed processing to deliver comprehensive internal and external defect detection. Designed for future-proof factory automation, it ensures maximum throughput with exceptional inspection accuracy.

Why Choose the PX40i?
1. AI-powered 6-sided infrared inspection for complete internal and external defect detection.
2. 3D BGA inspection for precise co-planarity defect detection.
3. Future-proof design supporting advanced factory automation needs.
4. High-speed processing to maximise throughput and productivity.
5. Cutting-edge AI-driven infrared (IR) vision technology for superior inspection performance.

Applications:
• Die sorting and inspection.
• BGA co-planarity inspection.
• Semiconductor and electronics manufacturing lines.

Visit Us!
Experience how PX40i can accelerate your production efficiency and inspection capabilities. Visit us at #L2201 to explore our latest smart vision innovations.
 

V510i - Advanced 3D Optical Inspection (AOI) for Advanced Packaging and Microelectronics (Semicon AOI & Micro AOI)

• Functionality:
An AI-powered, high-performance optical inspection solution designed for back-end semiconductor packaging. It offers powerful vision capabilities, advanced algorithms, and optimised lighting for precise inspection of wire bonds, die defects, and high-density SIP & solder bumps. IPC-CFX-2591 QPL validation ensures manufacturing quality and accurate die-level defect detection, making it ideal for advanced packaging.

Why Choose V510i Advanced 3D AOI?
1.Delivers high-accuracy 3D inspection for mirror components and reflective die.
2. Covers lead frame, die, and wire bond inspection for advanced packaging.
3. Enables real-time closed-loop data cross-referencing across ViTrox solutions (SPI to AXI).
4. Trusted by top EMS companies for its reliability and performance.
5. Smart manufacturing-ready, supporting Industry 4.0 integration.

Breakthrough Technologies:
• Real 3D measurement for accurate and reliable inspection.
• Seamless integration for advanced packaging inspections.
• High-accuracy 3D inspection for mirror components and reflective die.
• Real-time closed-loop data cross-referencing for optimised production.

Applications:
• Advanced packaging applications (lead frame, die, wire bond inspection).
• Mirror and reflective component inspection.
• Semiconductor, electronics, and precision component industries.

Visit Us!
Visit us at #L2201 to explore how the V510i Advanced 3D AOI can optimise your inspection processes, improving efficiency with high-accuracy performance and smart manufacturing capabilities.

V-ONE - Manufacturing Intelligence Solution Towards Industry 5.0

• Functionality:
Ensures seamless connectivity across the production line with real-time data visualisation, A.I.-driven insights, and comprehensive traceability for optimising production efficiency and quality.

Why Choose the V-ONE?
1. Enhances production efficiency through real-time data and A.I. predictions.
2. Provides accurate data visualisation and analysis with the AOI Intelligent Control Tower.
3. Monitors machine hardware and utilisation for optimal performance.
4. Enables real-time cross-referencing of inspection results and component images.
5. Offers full traceability to improve production and maintain quality.

Breakthrough Technologies:
• Customisable drill-down charts and dashboards.
• AOI Intelligent Control Tower for multi-line data analysis and impact assessments.
• ONE View feature for seamless data correlation across SMT PCBA solutions (SPI, AOI, AXI).
• A.I.-driven real-time insights and predictive capabilities.

Applications:
• Smart manufacturing environments.
• SMT PCBA inspection solutions.
• Intelligent production lines requiring real-time monitoring and optimisation.

Visit Us!
Experience the power of V-ONE in revolutionising your production line with cutting-edge manufacturing intelligence. Visit us at #L2201 to discover how V-ONE can transform your manufacturing operations.