Onto Innovation Southeast Asia Pte. Limited

Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. This new technology is the foundation of Onto Innovation’s products designed to offer fast throughput, increased brightfield and darkfield sensitivity and solves site challenges related to large package inspection.

The Dragonfly G3 system offers Clearfind® Technology for non-visual residue detection. For specialty markets, such as CMOS image sensors (CIS), the Dragonfly System uses a combination of oblique angle illumination with sophisticated image processing and a machine-learning algorithm to detect low contrast defects in the active pixel sensor area.The Dragonfly G3 system is tightly integrated with control and analytical software for real-time analysis and review, IR defect inspection and review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users now have the tools to visualize data, correlate process variations and improve yields through exploratory data analysis down to the bump level.

The Firefly G3 platform offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique to detect residue defects on metal and metal defects on organic layers. The combination of high sensitivity inspection, 2D/3D metrology and on tool color image capture capability in a single platform reduces capital investment requirements and provides a reliable pathway for panel-based process applications that require high I/O counts and multiple-chip integration.

Integration with Onto Innovation’s Discover® Defect and TrueADC® software quickly turns defect data into actionable process control, improves defect classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.

Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.

The Aspect system is powered by a powerful software analysis engine, Ai Diffract™ Technology, that provides up to 90% faster time to solution which extends the industry leading NanoDiffract® software by leveraging extensive machine learning capabilities along with high fidelity modeling. The result is a simultaneous improvement in metrology performance along with a significant time to solution reduction.

The Iris C1 system combines a proprietary spectroscopic ellipsometry solution from the Atlas® family with Onto Innovation’s industry leading Ai Diffract™ OCD analysis software, enabling high precision control of every critical semiconductor process step. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The system also features advanced pattern recognition, improved thickness reproducibility and throughput. The software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The Iris system and Ai Diffract solution provides insight of complex structure profiles across etch, clean, deposition, CMP and thin films.

The Iris T1 is a spectroscopic ellipsometer system that provides accurate, repeatable in-line thickness and optical constant measurements of single and multi-layer dielectric films for fab-wide applications. Built on the same field-proven Atlas platform, the Iris T1 system leverages the most recent advances in optics and algorithms, making it best-in-class for performance and cost-of-ownership. The SEMI/CE compliant software interface enables recipe sharing between the Iris series. 

The Iris S system offers a single platform solution for thin film, OCD, and wafer bow and film stress measurements on 150, 200 & 300mm wafers. It can handle a broad variety of substrates, including but not limited to SiC, GaN, glass and silicon. The system incorporates a dual-arm robot, high-precision stage, advanced pattern recognition, and a high-speed focus system for high positioning accuracy at high throughput. A state-of-the-art dual channel optical architecture offers oblique incidence Mueller Matrix spectroscopic ellipsometry (MMSE) and normal incidence spectroscopic reflectometry (SR) in a broad wavelength range from UV to IR wavelengths.

Discover Defect Software, previously known as Discover Enterprise Software, is a software solution that readily integrates into the production environment. Discover Defect Software flexibly brings together all pertinent fab information, including defect, sort, metrology, wip, and electrical, into a single big data-capable solution. Speed and up-time are world class.

Discover Defect Software will pay for itself repeatedly by enabling its users to quickly and accurately identify and solve problems, as well as to monitor and alarm on known areas of concern. The product is designed to improve both throughput and yield while simultaneously reducing manufacturing costs.

Expand your yield analysis capabilities with the power of the Discover Yield Software module. Discover Yield's patented data mining capabilities and advanced statistical analysis allows for highly sophisticated, interactive root cause analysis. Discover Yield Software gives you the power to deep-dive into your data to uncover very difficult to identify systemic process issues.