Welcome to meeting Oxford Instruments experts at booth#B1625
Overview
Advance your semiconductor fabrication and characterisation processes with Oxford Instruments’ full spectrum of solutions. Measure crystal homogeneity, material stress and strain in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using atomic force microscopy; evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray); and achieve precise and consistent plasma etch, deposition and interface optimisation of micro- & nano-structures and films, using atomic layer etch, atomic layer deposition, ICP (etch & dep), PECVD and plasma polish techniques, with our plasma technology solutions.