Stop by our booth and you will be surprise what we can offer
Overview
Polytec has been bringing light into the darkness for more than 50 years. With nearly 500 employees worldwide we develop, produce and distribute optical measurement technology solutions for research and industry. Our quality innovative products have an excellent reputation internationally among the expert community. We find solutions tailored to our customers’ requirements.
Since its foundation in 1967, Polytec has grown into an international high-tech company. Our headquarters are located in Baden-Württemberg, Germany. In addition, we maintain subsidiaries in the USA, England, France, Japan, Singapore and China.
In Polytec South-East Asia Pte Ltd, we specialize in the technological fields of
- Vibrometry
- Velocimetry
- 3D Surface Metrology
Inspired by the rapid further development of microelectromechanical systems and MEMS, Polytec presents this highly innovative product line of microscope-based measurement systems. MSA Micro System Analyzers from Polytec validate dynamics and topography of microsystems reliably with utmost precision. Determine transfer functions, use unique all-in-one instruments for both the static and dynamic 3D characterization of microsystems, measure and see through Si encapsulations and integrate your test-setup into (vacuum) probe stations.
For the very 1st time, showcasing in this region the MSA-650 IRIS, without need for preparing nor decapping the device. Measuring through intact silicon caps on encapsulated microstructures like e.g. inertial sensors, MEMS microphones, pressure sensors and more.
The MSA-600-S is the specialized optical measurement workstation designed for 6 GHz real-time vibration analysis and surface topography analysis. Ideal for testing GHz MEMS like FBAR (film bulk acoustic resonators), BAW (bulk acoustic wave) filters and SAW (surface acoustic wave), and other GHz resonators and devices.
TopMap Micro.View® uses Coherence Scanning Interferometry (CSI), powered with Polytec’s powerful Correlogram Technology delivers the most detailed analysis of surface roughness, texture and microstructure topography. CSI is an interesting technology to deploy to help measure and to help characterize some of the physical dimensions of a MEMS device.