High-performance IC Substrates
Digitalization has been moving at tremendous pace in the last decade and was accelerated even more by the pandemic. New applications have emerged and data traffic and processing have grown significantly. The infrastructure required for supporting growth in high-performance computing, storage, networking, connectivity and sensing devices, cloud and edge computing, and artificial intelligence is highly dependent on advanced IC Substrates. Demand for Substrates is forecast to rise exponentially, which has already let to scarcity on the supply side.
Advanced Substrates for Heterogeneous Packaging:
▪ Embedding passives and actives
▪ Cavity for thickness reduction, densification, and shielding
▪ Magnetics for inductors and shielding
▪ Multifunctional cores for power delivery
▪ Fine line structuring & small via formation for more advanced interconnects
▪ Fan-out, panel-level packaging concepts
▪ Loss-reducing waveguides and functional integration of silicon optics