Regional Business Network

Singapore,  Singapore 
Singapore
http://www.rbnpl.com
  • Booth: B1820

Overview

Regional Business Network Pte Ltd. Product & Services We serve the semiconductor wafer fab & advanced wafer level packaging (WLP, WLCSP, eWLB, Flip Chip Bumping & TSV) industry specialize in the following area:

1) Wafer Metrology & Inspection Equipment – Si/Glass thickness, Thick Film/PR layer thickness, CD, Roughness, 2D/3D Profiler, XRF, TXRF, Resistivity 4 Point Probe System.

2)Dry/Wet Etch, Thin Film Deposition process Equipment – Single wafer, batch process clean, PR-strip/Metal etch, CVD/PVD/PECVD/Plasma-RIE

3)Wafer Handling Equipment – Fully Automated Taping, Detaping(UV), Mounting/De-Mounting, Bonding, OCR/Barcode reading/printing & ultra-thin wafer transfer sorter

4)Specialty Materials & Chemicals (metal etch and photoresist strip)

  Products

  • Heidelberg Instruments
    Heidelberg Instruments is a global leader in designing, developing, and manufacturing of direct write lithography systems for micro- and nano- and 3D-patterning that are used in the research institutions and by industrial facilities around the world....

    • There are 2 Direct Write Technologies includes Laser Lithography and Thermal Scanning Probe Lithography

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Base Loader Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Lamination; Sheet Laminating Equipment
  • Vision; ID; Bar Code Systems
    • 203 Equipment, Inspection & Measurement
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Line Width; Critical Dimension (CD) Measurement
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 204 Equipment, Mems
  • Deep RIE etching; Dry etching
  • Wafer Level Bonders
    • 206 PV Equipment
  • Inspection and Metrology
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure - Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Transfer Systems for Wafer; Reticles or FPD's
  • Wafer Identification; Marking Equipment
    • 208 Equipment, Test
  • Probing Equipment (incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers)
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
    • 900 Support Products
  • Analytical Standards; Calibrators
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