SET CORPORATION SA

Saint Jeoire,  France
http://www.set-sas.fr
  • Booth: B1730

Develop the chips of the future with SET Flip-Chip Bonders.

Overview

SET (Smart Equipment Technology) is a world-leading supplier of high-accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutionsSince 1975, we have designed and manufactured leading-edge semiconductor equipment for high-precision applications.

Ranging from manual-loading to fully-automated solutions, our Flip-Chip Bonders cover a wide range of bonding applications and possess the unique ability to handle and bond fragile and/or small components onto substrates up to 300 mm.

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