Develop the chips of the future with SET Flip-Chip Bonders.
Overview
SET (Smart Equipment Technology) is a world-leading supplier of high-accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. Since 1975, we have designed and manufactured leading-edge semiconductor equipment for high-precision applications.
We support laboratories and semiconductor companies seeking world-class precision and superlative reliability in the assembly of their components. With our Flip-Chip Bonders installed worldwide, SET’s equipment is globally renowned for unsurpassed sub-micron accuracy and incomparable flexibility.
Ranging from manual-loading to fully-automated solutions, our Flip-Chip Bonders cover a wide range of bonding applications and possess the unique ability to handle and bond fragile and/or small components onto substrates up to 300 mm.